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FPF1504LBUCX

Onsemi

FPF1504LBUCX by Onsemi

FPF1504LBUCX by Onsemi is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. It features a grid array package style, ultra-thin profile, and fine pitch terminals. With a temperature range of -40 to 85°C, this CMOS technology IC supports power supply circuits efficiently.

Median Price

$0.615

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.593

1k+ parts

$0.492

10k+ parts

$0.439

6,000

-

$0.593

$0.492

$0.439

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.740

10k+ parts

-

6,000

-

-

$0.740

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.615

10k+ parts

$0.549

6,000

-

-

$0.615

$0.549

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,847 parts In-Stock

1+ parts

$0.462

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

$0.462

-

-

-

Vyrian

USA . 3,310 parts In-Stock

1+ parts

$0.486

100+ parts

-

1k+ parts

-

10k+ parts

-

3,310

$0.486

-

-

-

DigiKey Marketplace

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 74 parts In-Stock

1+ parts

$0.199

100+ parts

-

1k+ parts

-

10k+ parts

$0.191

74

$0.199

-

-

$0.191

Northwest PG Solutions

USA . 139 parts In-Stock

1+ parts

$0.219

100+ parts

-

1k+ parts

-

10k+ parts

$0.193

139

$0.219

-

-

$0.193

Corphita

USA . 1,392 parts In-Stock

1+ parts

$0.437

100+ parts

-

1k+ parts

-

10k+ parts

-

1,392

$0.437

-

-

-

Corohmni

South Africa . 208 parts In-Stock

1+ parts

$0.486

100+ parts

-

1k+ parts

-

10k+ parts

-

208

$0.486

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,262

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

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SupplyDigital Components

Austria . 6,057 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,057

-

-

-

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

-

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Problanco Electronics

Mexico . 2,809 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,809

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-

-

-

Microchip USA

USA . 2,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,745

-

-

-

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TANS Electronics

Latvia . 2,277 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,277

-

-

-

-

Kulean Microsystems

USA . 2,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,136

-

-

-

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Supply Digital

USA . 1,969 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,969

-

-

-

-

UHIMA Technologies

Türkiye . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

440

-

-

-

-

Overview

Discover the power of the FPF1504LBUCX by Onsemi, a top-of-the-line Power Management IC that guarantees high-quality performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this IC offers cutting-edge technology for industrial applications. With a wide range of operating temperatures and ultra-thin profile, this product ensures optimal functionality in any environment. Say goodbye to power supply issues with the FPF1504LBUCX, providing customers with unmatched value and benefits that will elevate their projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for convenient and easy installation on PCB boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a commonly used supply voltage, ensuring compatibility with a wide range of electronic systems.

No. of Terminals: 4

With a compact design and only 4 terminals, it saves space on the PCB and simplifies the layout of the circuit.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial applications where temperature may vary.

Minimum Operating Temperature: -40 °C

Ability to function in low temperatures makes it versatile and reliable in various environmental conditions.

Technical Specifications

Power Management ICs FPF1504LBUCX attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B4

Length:

.96 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,16

Package Shape:

Package Style (Meter):

GRID ARRAY, ULTRA THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

.96 mm

Trade Compliance

FPF1504LBUCX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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