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FPF1204UCX_F013

Onsemi

FPF1204UCX_F013 by Onsemi

FPF1204UCX_F013 by Onsemi is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. Featuring a grid array package style, ultra-thin profile, and fine pitch terminals, it operates b/w -40°C to 85°C. With CMOS technology and a max supply voltage of 5.5V, this IC supports power supply circuits efficiently.

Median Price

$0.480

Lifecycle Status

EOL

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 4,281,000 parts In-Stock

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4,281,000

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Rochester

USA . 51,800 parts In-Stock

1+ parts

-

100+ parts

$0.462

1k+ parts

$0.384

10k+ parts

$0.342

51,800

-

$0.462

$0.384

$0.342

DigiKey

USA . 51,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.580

10k+ parts

-

51,800

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-

$0.580

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Verical

USA . 48,000 parts In-Stock

1+ parts

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$0.480

10k+ parts

$0.428

48,000

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-

$0.480

$0.428

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,075 parts In-Stock

1+ parts

$0.360

100+ parts

-

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1,075

$0.360

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.366

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10

$0.366

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Flip Electronics

USA . 3,786,000 parts In-Stock

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3,786,000

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Vyrian

USA . 1,458,180 parts In-Stock

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1,458,180

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DigiKey Marketplace

USA . 48,000 parts In-Stock

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48,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,458,080 parts In-Stock

1+ parts

$0.322

100+ parts

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1,458,080

$0.322

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Corphita

USA . 2,459 parts In-Stock

1+ parts

$0.341

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2,459

$0.341

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Corohmni

South Africa . 325 parts In-Stock

1+ parts

$0.351

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325

$0.351

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Continental Prestige Electronics

USA . 55,407 parts In-Stock

1+ parts

$0.366

100+ parts

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10k+ parts

$0.358

55,407

$0.366

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-

$0.358

Argo Parts USA

USA . 3,229 parts In-Stock

1+ parts

$0.366

100+ parts

-

1k+ parts

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10k+ parts

$0.355

3,229

$0.366

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-

$0.355

Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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90,000

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QUARKTWIN TECHNOLOGY LTD

USA . 27,157 parts In-Stock

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SupplyDigital Components

Austria . 5,326 parts In-Stock

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5,326

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 3,269 parts In-Stock

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3,269

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TANS Electronics

Latvia . 3,064 parts In-Stock

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3,064

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$0.358

1k+ parts

$0.347

10k+ parts

$0.340

2,000

-

$0.358

$0.347

$0.340

UHIMA Technologies

Türkiye . 896 parts In-Stock

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896

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Kulean Microsystems

USA . 279 parts In-Stock

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279

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Overview

Unleash the power of efficient and reliable power management with the FPF1204UCX_F013 by Onsemi. Crafted with precision and excellence, this Power Management IC offers unparalleled performance and versatility in a compact square package. Ideal for industrial applications, this cutting-edge technology ensures seamless operation in extreme temperature conditions. Experience peace of mind knowing your devices are in safe hands with Onsemi's top-tier quality and innovation. Elevate your products to new heights with the FPF1204UCX_F013, where reliability meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability makes the product easy to integrate onto a printed circuit board, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is common in many applications, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Technical Specifications

Power Management ICs FPF1204UCX_F013 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

S-PBGA-B4

Length:

.76 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,16

Package Shape:

Package Style (Meter):

GRID ARRAY, ULTRA THIN PROFILE, FINE PITCH

Maximum Seated Height:

.539 mm

Maximum Supply Current (Isup):

.0015 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width (mm):

.76 mm

Trade Compliance

FPF1204UCX_F013 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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