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FODM8801CR2V

Onsemi

FODM8801CR2V by Onsemi

FODM8801CR2V by Onsemi is a single optocoupler with a max forward current of 0.02A and min operating temperature of -40°C. With a nominal current transfer ratio of 330%, it is ideal for applications requiring high isolation voltage up to 3750V, such as in power supplies and industrial controls.

Median Price

$1.337

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 50 parts In-Stock

1+ parts

$0.526

100+ parts

$0.500

1k+ parts

$0.500

10k+ parts

-

50

$0.526

$0.500

$0.500

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Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

$1.337

100+ parts

$0.889

1k+ parts

$0.780

10k+ parts

-

2,500

$1.337

$0.889

$0.780

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DigiKey

USA . 7,232 parts In-Stock

1+ parts

$2.080

100+ parts

$1.138

1k+ parts

$0.933

10k+ parts

$0.826

7,232

$2.080

$1.138

$0.933

$0.826

Mouser Electronics

USA . 2,351 parts In-Stock

1+ parts

$2.080

100+ parts

$1.140

1k+ parts

$0.933

10k+ parts

$0.825

2,351

$2.080

$1.140

$0.933

$0.825

Farnell

UK . 3,584 parts In-Stock

1+ parts

$2.382

100+ parts

$1.039

1k+ parts

$0.839

10k+ parts

$0.762

3,584

$2.382

$1.039

$0.839

$0.762

Avnet

USA . 90,000 parts In-Stock

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Verical

USA . 55,000 parts In-Stock

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$0.731

55,000

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$0.731

Arrow

USA . 2,500 parts In-Stock

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$0.860

2,500

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$0.860

Newark

USA . 2,500 parts In-Stock

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$0.291

2,500

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$0.291

Element14

Singapore . 2,500 parts In-Stock

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$1.370

2,500

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$1.370

Distributors (In-Stock)

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Digiode

USA . 2,179 parts In-Stock

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$0.500

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2,179

$0.500

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Nova Conductors

Japan . 95 parts In-Stock

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$0.848

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95

$0.848

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Flip Electronics

USA . 35,000 parts In-Stock

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Chip Stock

USA . 19,700 parts In-Stock

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19,700

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Vyrian

USA . 2,521 parts In-Stock

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2,521

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IBS Electronics

USA . 2,500 parts In-Stock

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$0.669

2,500

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$0.669

Bristol Electronics

USA . 1,948 parts In-Stock

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1,948

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Flex Direct, LLC

USA . 1,948 parts In-Stock

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1,948

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Prism Electronics

USA . 14 parts In-Stock

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14

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Contempo Components LLC

USA . 13 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,773 parts In-Stock

1+ parts

$0.334

100+ parts

-

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3,773

$0.334

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Semicontronic

India . 4,801 parts In-Stock

1+ parts

$0.447

100+ parts

$0.436

1k+ parts

$0.434

10k+ parts

-

4,801

$0.447

$0.436

$0.434

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Ampacity Inc.

Singapore . 2,163 parts In-Stock

1+ parts

$0.447

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2,163

$0.447

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Corphita

USA . 1,950 parts In-Stock

1+ parts

$0.473

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1,950

$0.473

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Corohmni

South Africa . 244 parts In-Stock

1+ parts

$0.526

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244

$0.526

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$0.526

100+ parts

$0.500

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$0.500

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50

$0.526

$0.500

$0.500

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Continental Prestige Electronics

USA . 4,818 parts In-Stock

1+ parts

$0.848

100+ parts

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$0.831

4,818

$0.848

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-

$0.831

Argo Parts USA

USA . 258 parts In-Stock

1+ parts

$0.848

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258

$0.848

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QUARKTWIN TECHNOLOGY LTD

USA . 15,787 parts In-Stock

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Lixinc

USA . 15,218 parts In-Stock

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SupplyDigital Components

Austria . 8,288 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,430 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,953 parts In-Stock

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Perfect Parts

USA . 2,912 parts In-Stock

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2,912

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Robosynatics

Brazil . 2,887 parts In-Stock

1+ parts

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$0.460

1k+ parts

$0.450

10k+ parts

$0.450

2,887

-

$0.460

$0.450

$0.450

Lucentia Tech

USA . 2,887 parts In-Stock

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$0.460

1k+ parts

$0.450

10k+ parts

$0.450

2,887

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$0.460

$0.450

$0.450

Supply Digital

USA . 2,778 parts In-Stock

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TANS Electronics

Latvia . 2,667 parts In-Stock

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Problanco Electronics

Mexico . 2,264 parts In-Stock

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Metaverse IC Inc.

Canada . 2,250 parts In-Stock

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Kulean Microsystems

USA . 373 parts In-Stock

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373

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GreenTree Electronics

Israel . 100 parts In-Stock

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UHIMA Technologies

Türkiye . 79 parts In-Stock

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Modulus Dynamics

Lithuania . 72 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the FODM8801CR2V optocoupler transistor output by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge technology to meet industry standards. Ideal for applications in industrial automation, medical equipment, and consumer electronics, this product offers a seamless integration with its single configuration and high current transfer ratio. Experience the value of enhanced safety, reduced power consumption, and improved signal isolation with the FODM8801CR2V by Onsemi. Elevate your projects with confidence and precision.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration allows for easy and efficient interfacing with other electronic components.

Maximum Forward Current: 0.02 A

The high maximum forward current allows for reliable operation under various load conditions.

Optoelectronic Type: TRANSISTOR OUTPUT OPTOCOUPLER

Transistor output optocoupler provides high performance and flexibility in controlling output signals.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures stable performance in different environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without risk of failure.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Maximum Power Dissipation: 0.15 W

Low power dissipation helps in efficient utilization of power and minimizes heat generation.

Minimum Current Transfer Ratio: 100 %

High minimum current transfer ratio ensures accurate and reliable signal transfer between input and output.

Maximum Dark Current: 100 nA

Low maximum dark current ensures minimal leakage current in off state, improving overall efficiency.

Maximum Response Time: 0.00002 s

Fast response time enables quick switching between on and off states, suitable for high-speed applications.

Minimum Collector-emitter Breakdown Voltage: 75 V

High minimum collector-emitter breakdown voltage provides protection against voltage fluctuations and surges.

Nominal Current Transfer Ratio: 330 %

High nominal current transfer ratio indicates strong signal amplification and accuracy in signal transmission.

Maximum Isolation Voltage: 3750 V

High maximum isolation voltage ensures safe separation between input and output circuits, preventing signal interference.

Mounting Feature: SURFACE MOUNT

Surface mounting feature offers easy and secure installation on circuit boards, saving space and simplifying assembly.

Maximum Forward Voltage: 1.8 V

Low maximum forward voltage reduces power losses and improves overall energy efficiency.

Maximum On State Current: 0.03 A

High maximum on state current capacity allows for handling larger output loads with ease.

Technical Specifications

Optocoupler Transistor Outputs FODM8801CR2V attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Minimum Collector-emitter Breakdown Voltage:

75 V

Configuration:

SINGLE

Minimum Current Transfer Ratio:

100 %

Nominal Current Transfer Ratio:

330 %

Maximum Dark Current:

100 nA

Maximum Forward Current:

.02 A

Maximum Forward Voltage:

1.8 V

Maximum Isolation Voltage:

3750 V

JESD-609 Code:

e4

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.03 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.15 W

Maximum Response Time:

.00002 s

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

Trade Compliance

FODM8801CR2V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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