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FODM121AR2V

Onsemi

FODM121AR2V by Onsemi

FODM121AR2V by Onsemi is a single optocoupler with a max forward current of 0.05A and min C-E breakdown voltage of 80V. With a high isolation voltage of 3750V, it's ideal for applications requiring reliable signal transmission in harsh environments. Suitable for surface mounting, this transistor output optocoupler has a low dark current of 100nA and operates b/w -40°C to 100°C.

Median Price

$0.200

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

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Adafruit Industries

USA . 70 parts In-Stock

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$0.045

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Arrow

USA . 89 parts In-Stock

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$0.200

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$0.164

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$0.164

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Mouser Electronics

USA . 10,209 parts In-Stock

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$0.510

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$0.248

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$0.234

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10,209

$0.510

$0.248

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$0.173

DigiKey

USA . 7 parts In-Stock

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$0.600

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$0.297

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$0.229

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$0.193

7

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Flip Electronics (Authorized)

USA . 240,000 parts In-Stock

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RS (Exports)

UK . 600 parts In-Stock

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$0.226

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$0.214

Chip1Stop

Japan . 100 parts In-Stock

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$0.171

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Verical

USA . 89 parts In-Stock

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$0.164

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Distributors (In-Stock)

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Digiode

USA . 514 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$0.286

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Maritex

Poland . 6,965 parts In-Stock

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$0.325

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$0.169

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$0.158

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$0.141

6,965

$0.325

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Chip Stock

USA . 71,860 parts In-Stock

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Vyrian

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IBS Electronics

USA . 7,031 parts In-Stock

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$0.156

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$0.150

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NAC Semi

USA . 5,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,600 parts In-Stock

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Flip Electronics

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ComSIT Distribution GmbH

Germany . 1,875 parts In-Stock

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ComSIT USA

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Distributors (Availability)

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Semicontronic

India . 32,747 parts In-Stock

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$0.038

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$0.037

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$0.037

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Ampacity Inc.

Singapore . 29,145 parts In-Stock

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Corphita

USA . 1,730 parts In-Stock

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Corohmni

South Africa . 324 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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Continental Prestige Electronics

USA . 6,582 parts In-Stock

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$0.223

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$0.218

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Argo Parts USA

USA . 1,539 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.280

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Modulus Dynamics

Lithuania . 4,415 parts In-Stock

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Aztec Data Supply Inc.

USA . 113 parts In-Stock

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$0.661

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GreenTree Electronics

Israel . 100,000 parts In-Stock

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RC Electronics

USA . 92,559 parts In-Stock

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Glotronic Ltd.

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 8,231 parts In-Stock

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Problanco Electronics

Mexico . 7,869 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 5,136 parts In-Stock

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S.R.D Solutions

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Supply Digital

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Lixinc

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UHIMA Technologies

Türkiye . 504 parts In-Stock

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Overview

Experience superior quality and reliability with the FODM121AR2V optocoupler transistor output by Onsemi. This innovative product offers exceptional performance in a wide range of applications, providing customers with unparalleled value and benefits. With its single configuration and high current transfer ratio, this optocoupler is perfect for use in industrial automation, power management, and motor control systems. Trust Onsemi for cutting-edge technology that delivers results.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to install and use in various applications without the complexity of multiple components.

Maximum Forward Current: 0.05 A

The high maximum forward current allows for reliable operation even under high load conditions.

Optoelectronic Type: TRANSISTOR OUTPUT OPTOCOUPLER

Transistor output optocoupler offers high speed and low power consumption, making it suitable for a wide range of applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can be used in demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable performance in both extreme heat and cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance for long-term reliability.

Maximum Power Dissipation: 0.15 W

Low power dissipation ensures efficient operation and helps in preventing overheating of the device.

Minimum Current Transfer Ratio: 100 %

High minimum current transfer ratio ensures accurate signal transmission with minimal loss.

Maximum Dark Current: 100 nA

Low dark current helps in reducing power consumption and improves the signal-to-noise ratio.

Minimum Collector-emitter Breakdown Voltage: 80 V

High breakdown voltage provides protection against voltage spikes and ensures the durability of the device.

Nominal Current Transfer Ratio: 100 %

Consistent current transfer ratio ensures reliable and stable performance over the long term.

Maximum Isolation Voltage: 3750 V

High isolation voltage helps in preventing electrical interference and protects sensitive components in the circuit.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and secure installation on PCBs, saving space and simplifying the assembly process.

Maximum Forward Voltage: 1.3 V

Low forward voltage drop helps in reducing power loss and improving efficiency in the system.

Maximum On State Current: 0.08 A

High maximum on-state current capability allows for reliable switching and driving of loads in various applications.

Technical Specifications

Optocoupler Transistor Outputs FODM121AR2V attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED, VDE APPROVED

Minimum Collector-emitter Breakdown Voltage:

80 V

Configuration:

SINGLE

Minimum Current Transfer Ratio:

100 %

Nominal Current Transfer Ratio:

100 %

Maximum Dark Current:

100 nA

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.3 V

Maximum Isolation Voltage:

3750 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.08 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.15 W

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

Trade Compliance

FODM121AR2V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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