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FODM3011R2V

Onsemi

FODM3011R2V by Onsemi

FODM3011R2V by Onsemi is a single TRIAC output optocoupler with a max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 °C to 100°C, has an isolation voltage of 3750V, and is ideal for applications requiring optocoupler trigger device outputs in surface mount configurations.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

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QUARKTWIN TECHNOLOGY LTD

USA . 21,639 parts In-Stock

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TANS Electronics

Latvia . 6,832 parts In-Stock

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Kulean Microsystems

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Glotronic Ltd.

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Supply Digital

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Problanco Electronics

Mexico . 2,653 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 460 parts In-Stock

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Northwest PG Solutions

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Corohmni

South Africa . 294 parts In-Stock

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Native Components

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UHIMA Technologies

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Overview

Discover the power and reliability of the FODM3011R2V by Onsemi, a top-of-the-line Optocoupler Trigger Device Output. With a maximum on-state voltage of 3V and a maximum forward current of 0.06A, this product offers superior performance in a variety of applications. From industrial automation to consumer electronics, the possibilities are endless. Trust in Onsemi's reputation for quality and innovation as you experience the value and benefits that this product brings to your projects. Upgrade your designs with the FODM3011R2V and unlock a world of possibilities.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on-state voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Configuration: SINGLE

Single configuration simplifies the circuit design and makes installation easier.

Maximum Forward Current: 0.06 A

The high forward current rating allows for reliable operation even under heavy loads.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler offers high noise immunity and is suitable for switching AC loads.

Maximum Operating Temperature: 100 °C

High operating temperature range ensures stability and reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions as well.

Maximum Input Trigger Current: 0.01 A

Low trigger current ensures efficient operation and allows for compatibility with a wide range of control circuits.

Repetitive Off-state Voltage (Peak): 250 V

High off-state voltage rating enhances the product's ability to withstand voltage spikes and transients.

Packing Method: TR, 13 INCH

TR packing method is suitable for automated assembly processes and 13-inch reel size provides convenience in handling and storage.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current ensures minimal power loss during off-state operation.

Maximum Isolation Voltage: 3750 V

High isolation voltage rating provides safety and protection against voltage surges and ground loops.

Mounting Feature: SURFACE MOUNT

Surface mount feature offers space-saving design and ease of installation on PCBs.

Maximum On State Current: 0.07 A

High on-state current rating allows for robust performance and reliability in switching applications.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3011R2V attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.01 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR, 13 INCH

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3011R2V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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