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FOD4108SD

Onsemi

FOD4108SD by Onsemi

FOD4108SD by Onsemi is a single TRIAC output optocoupler with 3A peak surge current and 3V max on-state voltage. It operates b/w -55°C to 100°C, has 800V repetitive off-state voltage, and offers 5000V isolation. Ideal for triggering devices in applications requiring high isolation levels and reliable performance.

Median Price

$3.230

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 41 parts In-Stock

1+ parts

$2.340

100+ parts

$1.661

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41

$2.340

$1.661

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Mouser Electronics

USA . 1,000 parts In-Stock

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$3.230

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$1.990

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$1.720

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1,000

$3.230

$1.990

$1.720

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DigiKey

USA . 2,354 parts In-Stock

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$3.770

100+ parts

$2.179

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$1.835

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$1.686

2,354

$3.770

$2.179

$1.835

$1.686

Chip1Stop

Japan . 420 parts In-Stock

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$10.100

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$4.350

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$10.100

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Verical

USA . 41 parts In-Stock

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$1.661

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$1.661

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$1.815

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500

$1.815

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Digiode

USA . 348 parts In-Stock

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$2.185

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348

$2.185

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Chip Stock

USA . 325 parts In-Stock

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325

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Vyrian

USA . 268 parts In-Stock

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Connector Distribution Corp

USA . 97 parts In-Stock

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97

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Right Parts Inc.

USA . 97 parts In-Stock

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Flip Electronics

USA . 74 parts In-Stock

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Sensible Micro Corp

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,080 parts In-Stock

1+ parts

$0.627

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3,080

$0.627

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Ampacity Inc.

Singapore . 697 parts In-Stock

1+ parts

$1.330

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697

$1.330

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Semicontronic

India . 585 parts In-Stock

1+ parts

$1.330

100+ parts

$1.297

1k+ parts

$1.290

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585

$1.330

$1.297

$1.290

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Corohmni

South Africa . 82 parts In-Stock

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$1.562

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82

$1.562

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Continental Prestige Electronics

USA . 6,117 parts In-Stock

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$1.815

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$1.779

6,117

$1.815

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$1.779

Argo Parts USA

USA . 4,886 parts In-Stock

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$1.815

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4,886

$1.815

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Netroflash

USA . 2,000 parts In-Stock

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$1.815

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$1.779

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$1.815

$1.779

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Corphita

USA . 581 parts In-Stock

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$2.070

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581

$2.070

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QUARKTWIN TECHNOLOGY LTD

USA . 17,739 parts In-Stock

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Lixinc

USA . 14,544 parts In-Stock

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Infinite Electronics LLP (Excess)

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Problanco Electronics

Mexico . 7,767 parts In-Stock

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TANS Electronics

Latvia . 7,427 parts In-Stock

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Kulean Microsystems

USA . 5,113 parts In-Stock

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Perfect Parts

USA . 3,808 parts In-Stock

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SupplyDigital Components

Austria . 3,056 parts In-Stock

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Supply Digital

USA . 1,771 parts In-Stock

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UHIMA Technologies

Türkiye . 546 parts In-Stock

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546

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GreenTree Electronics

Israel . 520 parts In-Stock

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Authorized Procurement Solutions

USA . 420 parts In-Stock

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420

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Overview

Unleash the power of precision and reliability with the FOD4108SD by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and performance in every product they create. The FOD4108SD falls under the category of Optocoupler Trigger Device Outputs, offering a seamless integration into various applications. With a peak surge current of 3A and a maximum on-state voltage of 3V, this optocoupler provides unmatched value and benefits to customers seeking superior functionality and efficiency. Upgrade your systems with the FOD4108SD and experience the difference in performance today.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on-state voltage allows for efficient operation and better power management.

Configuration: SINGLE

Single configuration simplifies setup and installation process.

Peak Surge Current: 3 A

High peak surge current handling capability ensures reliable performance under heavy loads.

Maximum Forward Current: 0.03 A

Low forward current helps in reducing power consumption and heat generation.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER WITH ZERO CRSVR

Triac output optocoupler with zero cross over ensures precise and accurate output control.

Maximum Operating Temperature: 100 °C

High operating temperature range makes this product suitable for a variety of environments.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures product reliability in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity and corrosion resistance.

Maximum Input Trigger Current: 0.002 A

Low input trigger current requirement helps in reducing power consumption.

Repetitive Off-state Voltage (Peak): 800 V

High off-state voltage capability makes this product suitable for high voltage applications.

Packing Method: TR

TR packaging method ensures convenient handling and storage of the product.

Nominal Input Trigger Current: 0.65 mA

Nominal input trigger current ensures consistent and reliable performance.

Maximum Reverse Leakage Current: 0.00001 A

Very low reverse leakage current helps in maintaining signal integrity.

Minimum Peak Off-state Voltage: 800 V

High off-state voltage capability ensures reliable isolation between input and output.

Maximum Isolation Voltage: 5000 V

High isolation voltage makes this product suitable for applications requiring electrical separation.

Mounting Feature: SURFACE MOUNT

Surface mounting feature provides easy and secure installation on PCBs.

Technical Specifications

Optocoupler Trigger Device Outputs FOD4108SD attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.03 A

Maximum Input Trigger Current:

.002 A

Nominal Input Trigger Current:

.65 mA

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Packing Method:

TR

Minimum Peak Off-state Voltage:

800 V

Peak Surge Current:

3 A

Repetitive Off-state Voltage (Peak):

800 V

Maximum Reverse Leakage Current:

.00001 A

Sub-Category:

Optocoupler - Trigger Device Outputs

Terminal Finish:

Trade Compliance

FOD4108SD Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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