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FODM3062

Onsemi

FODM3062 by Onsemi

The Onsemi FODM3062 is a single TRIAC output optocoupler with max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 to 100 °C, has isolation voltage of 3750V, and peak off-state voltage of 600V. Ideal for triggering devices in applications requiring high isolation levels and surface mounting feature.

Median Price

$0.964

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21 parts In-Stock

1+ parts

-

100+ parts

$0.964

1k+ parts

$0.800

10k+ parts

$0.714

21

-

$0.964

$0.800

$0.714

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,352 parts In-Stock

1+ parts

$0.751

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-

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1,352

$0.751

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Vyrian

USA . 7,452 parts In-Stock

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7,452

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Prism Electronics

USA . 110 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 741 parts In-Stock

1+ parts

$0.046

100+ parts

-

1k+ parts

-

10k+ parts

$0.044

741

$0.046

-

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$0.044

Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$0.670

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2

$0.670

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Corphita

USA . 1,958 parts In-Stock

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$0.712

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1,958

$0.712

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Corohmni

South Africa . 134 parts In-Stock

1+ parts

$0.791

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134

$0.791

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TANS Electronics

Latvia . 7,423 parts In-Stock

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7,423

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Problanco Electronics

Mexico . 6,778 parts In-Stock

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SupplyDigital Components

Austria . 5,712 parts In-Stock

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5,712

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Kulean Microsystems

USA . 5,548 parts In-Stock

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5,548

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Supply Digital

USA . 2,731 parts In-Stock

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2,731

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Northwest PG Solutions

USA . 2,019 parts In-Stock

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2,019

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UHIMA Technologies

Türkiye . 353 parts In-Stock

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353

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Perfect Parts

USA . 123 parts In-Stock

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123

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Overview

Elevate your electronic projects with the FODM3062 by Onsemi. This optocoupler trigger device output boasts superior quality and reliability, thanks to its reputable manufacturer. Ideal for a range of applications, this product offers seamless connectivity and precise control. Experience the value of enhanced performance and efficiency, as well as the benefits of reliable operation and safety. Upgrade your projects with the FODM3062 and unlock a world of possibilities.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on-state voltage allows for efficient power switching.

Configuration: SINGLE

Simplifies circuit design and operation with a single configuration.

Maximum Forward Current: 0.06 A

Capable of handling moderate current loads for versatile applications.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler provides efficient switching capability.

Maximum Operating Temperature: 100 °C

Wide operating temperature range ensures reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions.

Maximum Input Trigger Current: 0.01 A

Low input trigger current for efficient control and operation.

Repetitive Off-state Voltage (Peak): 600 V

High off-state voltage rating for enhanced safety and protection.

Packing Method: TUBE

Convenient packing method for easy handling and storage.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current minimizes power loss and improves efficiency.

Minimum Peak Off-state Voltage: 600 V

High peak off-state voltage rating for robust performance and reliability.

Maximum Isolation Voltage: 3750 V

High isolation voltage ensures safe operation and protection against electrical hazards.

Mounting Feature: SURFACE MOUNT

Surface mount feature enables easy and secure installation in various applications.

Maximum On State Current: 0.07 A

Capable of handling higher current loads for increased versatility and performance.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3062 attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.01 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

600 V

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3062 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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