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FODM3022V

Onsemi

FODM3022V by Onsemi

The Onsemi FODM3022V is a single TRIAC output optocoupler with a max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 °C to 100°C, has an isolation voltage of 3750V, and is ideal for applications requiring optocoupler trigger device outputs in surface mount configurations.

Median Price

$0.283

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 100 parts In-Stock

1+ parts

$0.196

100+ parts

$0.178

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$0.161

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100

$0.196

$0.178

$0.161

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Rochester

USA . 2,990 parts In-Stock

1+ parts

$0.370

100+ parts

$0.360

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$0.360

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2,990

$0.370

$0.360

$0.360

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Distributors (In-Stock)

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Digiode

USA . 1,657 parts In-Stock

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$0.186

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Vyrian

USA . 1,928 parts In-Stock

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$0.196

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1,928

$0.196

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Distributors (Availability)

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Corphita

USA . 2,486 parts In-Stock

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$0.176

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2,486

$0.176

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$0.196

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$0.178

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$0.161

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100

$0.196

$0.178

$0.161

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Corohmni

South Africa . 95 parts In-Stock

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$0.701

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95

$0.701

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QUARKTWIN TECHNOLOGY LTD

USA . 25,065 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Kulean Microsystems

USA . 3,296 parts In-Stock

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Problanco Electronics

Mexico . 3,281 parts In-Stock

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SupplyDigital Components

Austria . 3,209 parts In-Stock

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Supply Digital

USA . 2,305 parts In-Stock

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TANS Electronics

Latvia . 2,262 parts In-Stock

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Northwest PG Solutions

USA . 2,008 parts In-Stock

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UHIMA Technologies

Türkiye . 261 parts In-Stock

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Native Components

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Overview

Discover the high-quality FODM3022V Optocoupler Trigger Device Output by Onsemi, a leading manufacturer known for their innovative solutions. This versatile component is perfect for applications requiring reliable galvanic isolation, such as industrial control systems and motor drives. Offering exceptional value and benefits, this product provides customers with peace of mind knowing they are investing in a trusted brand that delivers superior performance and durability. Choose the FODM3022V for your next project and experience the advantages it brings to your design.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low voltage requirement makes it suitable for low power applications, reducing overall power consumption.

Configuration: SINGLE

Simplified design and ease of use due to single configuration.

Maximum Forward Current: 0.06 A

Capable of handling moderate current loads efficiently.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output allows for bidirectional current flow, suitable for AC applications.

Maximum Operating Temperature: 100 °C

Wide operating temperature range allows for use in various environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures.

Maximum Input Trigger Current: 0.01 A

Low trigger current requirement enables easy triggering of the device.

Repetitive Off-state Voltage (Peak): 400 V

Ability to withstand high off-state voltages ensures reliability in different applications.

Packing Method: TUBE

Secure packaging for easy handling and storage.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current minimizes power loss and improves efficiency.

Maximum Isolation Voltage: 3750 V

High isolation voltage provides safety and protection from high voltage spikes.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and compact integration into circuit boards.

Maximum On State Current: 0.07 A

Capable of handling slightly higher current loads when needed.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3022V attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.01 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Repetitive Off-state Voltage (Peak):

400 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3022V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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