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MOC3071SR2VM

Onsemi

MOC3071SR2VM by Onsemi

MOC3071SR2VM by Onsemi is a TRIAC output optocoupler with a max on-state voltage of 2.5V and peak surge current of 1A. It operates b/w -40 to 85°C, has an isolation voltage of 4170V, and is ideal for triggering devices in optocoupler applications.

Median Price

$0.336

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Arrow

USA . 730 parts In-Stock

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DigiKey

USA . 668 parts In-Stock

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$1.100

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$0.571

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$0.454

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$0.386

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$0.386

Verical

USA . 730 parts In-Stock

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$0.305

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730

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Chip1Stop

Japan . 730 parts In-Stock

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$0.368

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$0.352

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Digiode

USA . 1,838 parts In-Stock

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 655 parts In-Stock

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$0.263

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Corphita

USA . 232 parts In-Stock

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Corohmni

South Africa . 99 parts In-Stock

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$0.309

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Aztec Data Supply Inc.

USA . 2,334 parts In-Stock

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SupplyDigital Components

Austria . 7,446 parts In-Stock

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Problanco Electronics

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TANS Electronics

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Continental Prestige Electronics

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Kulean Microsystems

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UHIMA Technologies

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Argo Parts USA

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Overview

Enhance the performance of your electronic devices with the MOC3071SR2VM optocoupler trigger device outputs by Onsemi. With a reputation for high-quality products, Onsemi delivers reliable components for various applications. The MOC3071SR2VM offers a peak surge current of 1A and a maximum isolation voltage of 4170V, ensuring optimal efficiency and safety. Upgrade your circuit designs with this surface-mount optoelectronic component and experience improved functionality and durability. Choose Onsemi for superior quality and performance in all your electronic projects.

Feature Benefit Bullets

Maximum On State Voltage: 2.5 V

The low on state voltage ensures efficient performance and reduces power consumption.

Configuration: SINGLE

SINGLE configuration simplifies installation and wiring, making it user-friendly.

Peak Surge Current: 1 A

High peak surge current capability provides robustness and protection against electrical surges.

Maximum Forward Current: 0.06 A

The high maximum forward current rating allows for reliable operation under varying load conditions.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler offers switching capabilities suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures the device can function in diverse environmental conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin terminal finish provides good solderability and mechanical strength.

Maximum Input Trigger Current: 0.015 A

Low trigger current allows for efficient operation and minimizes power consumption.

Repetitive Off-state Voltage (Peak): 800 V

High off-state voltage rating provides robust insulation and protection against voltage spikes.

Packing Method: TR

TR packing method ensures convenient handling and storage of the product.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current minimizes power losses and enhances overall efficiency.

Maximum Isolation Voltage: 4170 V

High isolation voltage ensures safety and prevents electrical hazards in the circuit.

Mounting Feature: SURFACE MOUNT

Surface mounting feature simplifies PCB integration and saves space in the application.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3071SR2VM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.015 A

Maximum Isolation Voltage:

4170 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

2.5 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

800 V

Maximum Reverse Leakage Current:

.0001 A

Terminal Finish:

Trade Compliance

MOC3071SR2VM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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