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MOC3071M

Onsemi

MOC3071M by Onsemi

The Onsemi MOC3071M is a TRIAC output optocoupler with max on-state voltage of 2.5V, peak surge current of 1A, and isolation voltage of 4170V. It operates b/w -40 to 85°C, ideal for triggering devices in industrial applications requiring high isolation levels and low input trigger current.

Median Price

$0.950

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 275 parts In-Stock

1+ parts

$0.950

100+ parts

$0.490

1k+ parts

$0.387

10k+ parts

$0.327

275

$0.950

$0.490

$0.387

$0.327

Mouser Electronics

USA . 33 parts In-Stock

1+ parts

$0.950

100+ parts

$0.481

1k+ parts

$0.359

10k+ parts

$0.307

33

$0.950

$0.481

$0.359

$0.307

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$0.351

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870

$0.351

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TME

Poland . 1,102 parts In-Stock

1+ parts

$0.940

100+ parts

$0.362

1k+ parts

$0.338

10k+ parts

-

1,102

$0.940

$0.362

$0.338

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Digiode

USA . 2,041 parts In-Stock

1+ parts

$1.045

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2,041

$1.045

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Vyrian

USA . 5,658 parts In-Stock

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5,658

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Flip Electronics

USA . 1,170 parts In-Stock

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1,170

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First Choice Components Inc.

USA . 21 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 58 parts In-Stock

1+ parts

$0.344

100+ parts

-

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58

$0.344

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Continental Prestige Electronics

USA . 4,072 parts In-Stock

1+ parts

$0.351

100+ parts

-

1k+ parts

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10k+ parts

$0.344

4,072

$0.351

-

-

$0.344

Argo Parts USA

USA . 3,656 parts In-Stock

1+ parts

$0.351

100+ parts

-

1k+ parts

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10k+ parts

$0.340

3,656

$0.351

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-

$0.340

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.351

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500

$0.351

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Ampacity Inc.

Singapore . 137 parts In-Stock

1+ parts

$0.940

100+ parts

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137

$0.940

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Corphita

USA . 1,522 parts In-Stock

1+ parts

$0.990

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1,522

$0.990

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AZTECH Wire

Italy . 295 parts In-Stock

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$11.890

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295

$11.890

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Problanco Electronics

Mexico . 6,885 parts In-Stock

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6,885

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SupplyDigital Components

Austria . 6,534 parts In-Stock

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6,534

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TANS Electronics

Latvia . 4,641 parts In-Stock

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4,641

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Kulean Microsystems

USA . 2,357 parts In-Stock

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2,357

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UHIMA Technologies

Türkiye . 710 parts In-Stock

1+ parts

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710

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Overview

Unlock new possibilities with the MOC3071M from Onsemi. This optocoupler trigger device output is a game-changer in its category, offering unparalleled quality and reliability. With a peak surge current of 1A and maximum isolation voltage of 4170V, this product delivers exceptional performance in a wide range of applications. From industrial controls to consumer electronics, the MOC3071M provides the value, benefits, and advantages that customers are looking for. Trust Onsemi for innovative solutions that elevate your projects to the next level.

Feature Benefit Bullets

Maximum On State Voltage: 2.5 V

Low on-state voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Configuration: SINGLE

Single configuration makes it easy to integrate into various electronic circuits, simplifying the design process.

Peak Surge Current: 1 A

High peak surge current rating ensures reliable operation even during transient conditions or power surges.

Maximum Forward Current: 0.06 A

Suitable for low to moderate current applications, providing a safe operating limit for the device.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler allows for bidirectional current flow and control, making it suitable for switching applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions, making it versatile in various applications.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring a secure connection in the circuit.

Maximum Input Trigger Current: 0.015 A

Low trigger current requirement enables easy activation of the device, ensuring efficient operation in the circuit.

Repetitive Off-state Voltage (Peak): 800 V

High off-state voltage rating allows for reliable isolation between input and output, protecting sensitive components.

Packing Method: TUBE

Tube packaging provides protection during transportation and storage, ensuring the product reaches the end user in good condition.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current minimizes power loss and improves overall efficiency of the device.

Maximum Isolation Voltage: 4170 V

High isolation voltage rating ensures safe operation by providing a barrier between input and output circuits.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting offers secure and reliable attachment to the PCB, ensuring stability during operation and manufacturing.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3071M attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.015 A

Maximum Isolation Voltage:

4170 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

2.5 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

800 V

Maximum Reverse Leakage Current:

.0001 A

Terminal Finish:

TIN

Trade Compliance

MOC3071M Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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