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FOD4116DV

Onsemi

FOD4116DV by Onsemi

FOD4116DV by Onsemi is a single optocoupler trigger device with a max on-state voltage of 3V and peak surge current of 3A. It operates b/w -55 °C to 100°C, featuring a repetitive off-state voltage of 600V. Ideal for applications requiring high isolation voltage and through-hole mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,941 parts In-Stock

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Vyrian

USA . 445 parts In-Stock

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Northwest PG Solutions

USA . 1,923 parts In-Stock

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$2.867

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Kulean Microsystems

USA . 7,375 parts In-Stock

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TANS Electronics

Latvia . 7,298 parts In-Stock

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Problanco Electronics

Mexico . 3,563 parts In-Stock

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Corphita

USA . 2,457 parts In-Stock

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SupplyDigital Components

Austria . 2,404 parts In-Stock

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Native Components

USA . 707 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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UHIMA Technologies

Türkiye . 25 parts In-Stock

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Overview

Upgrade your electronics with the FOD4116DV by Onsemi, a high-quality optocoupler trigger device output that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product boasts a single configuration, a peak surge current of 3 A, and a maximum forward current of 0.03 A. Perfect for applications requiring precise control and isolation, the FOD4116DV provides a maximum operating temperature of 100 °C and a minimum operating temperature of -55°C. Experience the value and benefits of this innovative product today!

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low maximum on state voltage allows for efficient operation and helps in reducing power consumption.

Configuration: SINGLE

Single configuration makes it easy to integrate into a wide range of circuit designs with simplicity.

Peak Surge Current: 3 A

High peak surge current handling capability provides protection against sudden spikes in current, ensuring reliability in various operating conditions.

Maximum Forward Current: 0.03 A

Low maximum forward current ensures efficient operation and helps in prolonging the product's lifespan.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER WITH ZERO CRSVR

Triac output optocoupler with zero cross-over helps in reducing electromagnetic interference and provides precise switching control.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures the product can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in a wide range of temperature environments, making it versatile for various applications.

Maximum Input Trigger Current: 0.0013 A

Low maximum input trigger current ensures efficient operation and helps in reducing power consumption.

Repetitive Off-state Voltage (Peak): 600 V

High repetitive off-state voltage allows for reliable isolation between input and output, ensuring safety in high voltage applications.

Packing Method: TUBE

Tube packing method provides easy handling and storage of the product, facilitating efficient production and deployment.

Nominal Input Trigger Current: 0.65 mA

Nominal input trigger current provides a standard value for triggering the device, ensuring consistent performance across different applications.

Maximum Reverse Leakage Current: 0.00001 A

Low maximum reverse leakage current helps in preventing unnecessary power loss and ensures efficient operation.

Minimum Peak Off-state Voltage: 600 V

High minimum peak off-state voltage provides reliable isolation between input and output, ensuring safety in high voltage applications.

Maximum Isolation Voltage: 5000 V

High maximum isolation voltage ensures safe separation between input and output, protecting sensitive components from voltage surges.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides secure and stable installation of the product in various circuit designs, ensuring reliable operation.

Technical Specifications

Optocoupler Trigger Device Outputs FOD4116DV attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED, VDE APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.03 A

Maximum Input Trigger Current:

.0013 A

Nominal Input Trigger Current:

.65 mA

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

600 V

Peak Surge Current:

3 A

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.00001 A

Trade Compliance

FOD4116DV Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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