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FODM3053

Onsemi

FODM3053 by Onsemi

The Onsemi FODM3053 is a single TRIAC output optocoupler with a max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 °C to 100°C, has an isolation voltage of 3750V, and is ideal for applications requiring optocoupler trigger device outputs in surface mount configurations.

Median Price

$0.480

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,023 parts In-Stock

1+ parts

$0.480

100+ parts

$0.470

1k+ parts

$0.460

10k+ parts

-

18,023

$0.480

$0.470

$0.460

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Distributors (In-Stock)

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Digiode

USA . 2,400 parts In-Stock

1+ parts

$0.456

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-

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2,400

$0.456

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Vyrian

USA . 696 parts In-Stock

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$0.480

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696

$0.480

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Prism Electronics

USA . 41 parts In-Stock

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41

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Distributors (Availability)

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Native Components

USA . 786 parts In-Stock

1+ parts

$0.168

100+ parts

-

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$0.161

786

$0.168

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$0.161

Northwest PG Solutions

USA . 2,193 parts In-Stock

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$0.185

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-

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$0.163

2,193

$0.185

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$0.163

Corphita

USA . 1,945 parts In-Stock

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$0.432

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1,945

$0.432

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Corohmni

South Africa . 186 parts In-Stock

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$0.480

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186

$0.480

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Andel Nordic

Denmark . 5,005 parts In-Stock

1+ parts

$2.339

100+ parts

-

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$2.246

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$2.246

5,005

$2.339

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$2.246

$2.246

Component Stockers USA

USA . 458 parts In-Stock

1+ parts

$99.990

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458

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Metaverse IC Inc.

Canada . 33,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,280 parts In-Stock

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SupplyDigital Components

Austria . 7,896 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,111 parts In-Stock

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TANS Electronics

Latvia . 4,628 parts In-Stock

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Infinite Electronics LLP (Excess)

. 4,313 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,074 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kulean Microsystems

USA . 3,280 parts In-Stock

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3,280

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Problanco Electronics

Mexico . 1,497 parts In-Stock

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Supply Digital

USA . 196 parts In-Stock

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UHIMA Technologies

Türkiye . 172 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Enhance your electronics projects with the FODM3053 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their optocoupler trigger devices. The FODM3053's triac output optocoupler configuration offers a maximum forward current of 0.06 A and a repetitive off-state voltage of 600 V, making it ideal for a wide range of applications. With a maximum isolation voltage of 3750 V and a compact surface mount design, this product provides exceptional value, performance, and peace of mind for customers looking to elevate their designs.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on state voltage helps in efficient power management and reduces heat dissipation.

Configuration: SINGLE

Single configuration ensures simple and easy integration into circuits.

Maximum Forward Current: 0.06 A

Adequate forward current capability for various triggering applications.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler provides high switching speeds and noise immunity.

Maximum Operating Temperature: 100 °C

Wide operating temperature range allows for use in different environmental conditions.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperature environments.

Maximum Input Trigger Current: 0.005 A

Low trigger current requirement for efficient operation.

Repetitive Off-state Voltage (Peak): 600 V

High off-state voltage capability ensures safe operation in high voltage applications.

Packing Method: TUBE

Tube packaging provides easy handling and storage of the optocoupler devices.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current ensures minimal power loss during off-state operation.

Maximum Isolation Voltage: 3750 V

High isolation voltage rating ensures safe separation between input and output circuits.

Mounting Feature: SURFACE MOUNT

Surface mount capability for easy and compact PCB integration.

Maximum On State Current: 0.07 A

Sufficient on-state current handling capacity for reliable performance.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3053 attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3053 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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