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MOC3032SVM

Onsemi

MOC3032SVM by Onsemi

The Onsemi MOC3032SVM is a single TRIAC output optocoupler with 3V max on-state voltage and 1A peak surge current. Operating b/w -40 to 85 °C, it offers 250V repetitive off-state voltage for applications requiring high isolation voltage up to 4170V. Ideal for surface mount setups, it comes in tube packaging.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,291 parts In-Stock

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Vyrian

USA . 999 parts In-Stock

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SupplyDigital Components

Austria . 7,635 parts In-Stock

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Problanco Electronics

Mexico . 6,819 parts In-Stock

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Kulean Microsystems

USA . 4,731 parts In-Stock

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Supply Digital

USA . 2,840 parts In-Stock

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Corphita

USA . 2,748 parts In-Stock

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TANS Electronics

Latvia . 2,549 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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UHIMA Technologies

Türkiye . 257 parts In-Stock

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Corohmni

South Africa . 68 parts In-Stock

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Overview

Upgrade your electronics with the MOC3032SVM optocoupler trigger device outputs from Onsemi. With a peak surge current of 1A and maximum isolation voltage of 4170V, this product offers unparalleled quality and reliability. Perfect for a variety of applications, this triac output optocoupler provides customers with the value and benefits they need to enhance their projects. Trust in Onsemi's reputation for excellence and take your electronics to the next level with the MOC3032SVM.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low maximum on state voltage ensures efficient operation and helps in reducing power consumption.

Configuration: SINGLE

Single configuration makes the product easy to install and manage in various applications.

Peak Surge Current: 1 A

High peak surge current rating provides reliable protection against sudden spikes in current.

Maximum Forward Current: 0.06 A

Low maximum forward current helps in preventing overheating and ensures long-term reliability.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER WITH ZERO CRSVR

Triac output optocoupler with zero cross-over provides precise triggering and ensures accurate output control.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the product to be used in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function efficiently even in extreme cold conditions.

Maximum Input Trigger Current: 0.01 A

Low maximum input trigger current helps in minimizing input power requirements and ensures efficient operation.

Repetitive Off-state Voltage (Peak): 250 V

High repetitive off-state voltage rating ensures reliable performance and protects the device from voltage spikes.

Packing Method: TUBE

Tube packing method provides easy storage and transportation of the product.

Maximum Reverse Leakage Current: 0.0001 A

Low maximum reverse leakage current helps in reducing power losses and ensures optimal performance.

Minimum Peak Off-state Voltage: 250 V

High minimum peak off-state voltage provides robust insulation and protection against high voltage conditions.

Maximum Isolation Voltage: 4170 V

High isolation voltage rating ensures safe operation and protects the connected circuits from electrical hazards.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy installation on circuit boards and saves space in the application.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3032SVM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED, VDE APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.01 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

250 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3032SVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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