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FDY301NZ

Onsemi

FDY301NZ by Onsemi

FDY301NZ by Onsemi is a N-CHANNEL FET with 20V DS breakdown voltage and 0.2A max drain current. Ideal for switching applications, it features a built-in diode, operates in enhancement mode, and has a max power dissipation of 0.625W. This small outline transistor can handle up to 150°C operating temperature.

Median Price

$0.089

Lifecycle Status

EOL

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Farnell

UK . 256,362 parts In-Stock

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Rochester

USA . 75,785 parts In-Stock

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$0.093

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$0.077

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$0.069

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$0.077

$0.069

Verical

USA . 74,434 parts In-Stock

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$0.086

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Arrow

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Digiode

USA . 439 parts In-Stock

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$0.087

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Nova Conductors

Japan . 15 parts In-Stock

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Bristol Electronics

USA . 838 parts In-Stock

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$0.375

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$0.131

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838

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Flip Electronics

USA . 63,000 parts In-Stock

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Vyrian

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Chip Stock

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Sensible Micro Corp

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Netsource Technology, Inc.

USA . 2,905 parts In-Stock

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Semtec, LLC

USA . 2,750 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,587 parts In-Stock

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Cyclops Electronics Ltd

UK . 650 parts In-Stock

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Holdelec - ElecDif-Pro

France . 184 parts In-Stock

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Elcom Components

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Prism Electronics

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LittleDiode

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Semicontronic

India . 148,326 parts In-Stock

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$0.076

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$0.074

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$0.074

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148,326

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$0.074

$0.074

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Ampacity Inc.

Singapore . 107,844 parts In-Stock

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Corphita

USA . 1,774 parts In-Stock

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$0.083

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Corohmni

South Africa . 436 parts In-Stock

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$0.089

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436

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Netroflash

USA . 2,000 parts In-Stock

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$0.126

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$0.120

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$0.117

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$0.126

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$0.117

Argo Parts USA

USA . 231 parts In-Stock

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$0.126

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$0.122

231

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$0.122

Modulus Dynamics

Lithuania . 17,085 parts In-Stock

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$0.548

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$0.548

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$0.548

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17,085

$0.548

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Aztec Data Supply Inc.

USA . 2,635 parts In-Stock

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$0.671

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Continental Prestige Electronics

USA . 322,318 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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RC Electronics

USA . 67,037 parts In-Stock

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Perfect Parts

USA . 66,033 parts In-Stock

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Kepictronics

USA . 65,800 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

USA . 11,453 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Kulean Microsystems

USA . 5,920 parts In-Stock

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SupplyDigital Components

Austria . 5,898 parts In-Stock

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TANS Electronics

Latvia . 2,674 parts In-Stock

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Problanco Electronics

Mexico . 2,077 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,950 parts In-Stock

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Assy Fe

Spain . 1,742 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,587 parts In-Stock

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Supply Digital

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Glotronic Ltd.

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 854 parts In-Stock

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GreenTree Electronics

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Overview

Unlock the power of cutting-edge technology with the FDY301NZ by Onsemi. Crafted with precision and expertise, this small signal field effect transistor (FET) offers unmatched quality and reliability. Perfect for switching applications, this N-channel transistor boasts a single configuration with a built-in diode, ensuring optimal performance. With a maximum drain current of 0.2A and a minimum DS breakdown voltage of 20V, this transistor is designed to deliver exceptional results. Elevate your projects with the FDY301NZ and experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material makes the transistor lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have higher electron mobility, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse current flow, making the transistor suitable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications where fast response times are required.

Surface Mount: YES

The surface mount capability allows for easy integration on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20V allows for reliable operation in low voltage applications.

Maximum Drain Current (ID): 0.2 A

The high maximum drain current rating of 0.2A ensures the transistor can handle high current loads without overheating.

Maximum Power Dissipation: 0.625 W

The maximum power dissipation of 0.625W indicates the transistor's ability to handle heat dissipation effectively.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, the transistor can withstand high temperatures in various environments.

Maximum Drain-Source On Resistance: 5 ohm

The low drain-source on resistance of 5 ohms minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDY301NZ attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ESD PROTECTION

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.2 A

Maximum Drain Current (ID):

.2 A

Maximum Drain-Source On Resistance:

5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDY301NZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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