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FDS9400A

Onsemi

FDS9400A by Onsemi

FDS9400A by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max ID of 3.4A, 0.13 ohm RDS(on), and operates at up to 175°C. This small outline transistor has GULL WING terminals and is designed in METAL-OXIDE SEMICONDUCTOR technology for efficient performance.

Median Price

$0.636

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

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$0.059

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1

$0.059

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Farnell

UK . 26,104 parts In-Stock

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$1.195

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$1.195

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DigiKey

USA . 25,504 parts In-Stock

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$0.770

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25,504

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$0.770

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Rochester

USA . 24,694 parts In-Stock

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$0.613

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$0.509

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$0.454

24,694

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$0.613

$0.509

$0.454

Verical

USA . 19,829 parts In-Stock

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$0.636

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$0.567

19,829

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$0.636

$0.567

Flip Electronics (Authorized)

USA . 3,728 parts In-Stock

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Chip1Stop

Japan . 1 parts In-Stock

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Digiode

USA . 2,413 parts In-Stock

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$0.056

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2,413

$0.056

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Vyrian

USA . 700 parts In-Stock

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$0.059

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700

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Chip Stock

USA . 5,638 parts In-Stock

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Flip Electronics

USA . 3,728 parts In-Stock

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DigiKey Marketplace

USA . 3,728 parts In-Stock

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Semi Source

USA . 2,500 parts In-Stock

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Bristol Electronics

USA . 1,071 parts In-Stock

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North Shore Components

USA . 373 parts In-Stock

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Corphita

USA . 2,466 parts In-Stock

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$0.053

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$0.053

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Corohmni

South Africa . 256 parts In-Stock

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$0.059

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256

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Continental Prestige Electronics

USA . 30,048 parts In-Stock

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$0.921

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$0.921

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Native Components

USA . 931 parts In-Stock

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$1.496

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931

$1.496

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Northwest PG Solutions

USA . 1,224 parts In-Stock

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$1.646

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Perfect Parts

USA . 37,900 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,342 parts In-Stock

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SupplyDigital Components

Austria . 8,016 parts In-Stock

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TANS Electronics

Latvia . 7,540 parts In-Stock

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Kulean Microsystems

USA . 6,910 parts In-Stock

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Authorized Procurement Solutions

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RC Electronics

USA . 3,600 parts In-Stock

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$0.920

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$0.870

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$0.850

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$0.850

Problanco Electronics

Mexico . 3,089 parts In-Stock

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Kepictronics

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Supply Digital

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UHIMA Technologies

Türkiye . 265 parts In-Stock

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265

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Overview

Unlock the power of innovation with the FDS9400A by Onsemi. As a leader in small signal field effect transistors, Onsemi delivers top-notch quality and reliability. This P-channel transistor is perfect for switching applications, offering a high level of performance and efficiency. With its built-in diode, it simplifies circuit designs and saves space. Trust Onsemi to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the FDS9400A and experience the difference in quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: P-CHANNEL

Allows for efficient switching and control of current flow in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode within the transistor package, saving space and components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Allows for easy and compact mounting on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 30 V

Provides a high breakdown voltage, ensuring the transistor can handle higher voltage levels without failure.

Package Shape: RECTANGULAR

Offers a standardized shape for easy integration into various circuit designs.

Terminal Form: GULL WING

Facilitates easy soldering and connection to the circuit board, improving the overall reliability of the product.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer improved control over the current flow in the circuit, enhancing performance and efficiency.

Maximum Drain Current (Abs) (ID): 3.4 A

Can handle high current loads, making it suitable for demanding applications.

No. of Terminals: 8

Provides multiple connection points for versatile circuit integration and configuration.

Maximum Power Dissipation (Abs): 1 W

Withstands high power levels, ensuring reliable operation in power-hungry applications.

Package Style (Meter): SMALL OUTLINE

Compact package size saves space on the circuit board and allows for denser circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for efficient switching and control performance.

Maximum Operating Temperature: 175 °C

Suitable for use in a wide range of operating temperatures, ensuring reliability in various environmental conditions.

Transistor Element Material: SILICON

Silicon-based construction provides high performance and reliability for the transistor.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals improves solderability and connection reliability.

Maximum Drain-Source On Resistance: 0.13 ohm

Low on-resistance minimizes power loss and heat generation during operation, improving efficiency.

Terminal Position: DUAL

Dual terminal configuration allows for flexible connections and circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration, ensuring proper soldering and assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing processes without compromising performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDS9400A attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3.4 A

Maximum Drain Current (ID):

3.4 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS9400A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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