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FDS89161LZ

Onsemi

FDS89161LZ by Onsemi

FDS89161LZ by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, suitable for SWITCHING applications. It features 2 ELEMENTS WITH BUILT-IN DIODE in a RECTANGULAR package with GULL WING terminals. With a Max Pulsed Drain Current of 15A and Max Power Dissipation of 31W, it operates in ENHANCEMENT MODE at temperatures up to 150°C.

Median Price

$0.926

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 5 parts In-Stock

1+ parts

$0.238

100+ parts

$0.238

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$0.238

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5

$0.238

$0.238

$0.238

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Rochester

USA . 170,530 parts In-Stock

1+ parts

$0.800

100+ parts

$0.780

1k+ parts

$0.770

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170,530

$0.800

$0.780

$0.770

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Arrow

USA . 17 parts In-Stock

1+ parts

$1.053

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17

$1.053

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Farnell

UK . 222 parts In-Stock

1+ parts

$1.340

100+ parts

$0.665

1k+ parts

$0.526

10k+ parts

$0.517

222

$1.340

$0.665

$0.526

$0.517

Mouser Electronics

USA . 218 parts In-Stock

1+ parts

$2.290

100+ parts

$0.990

1k+ parts

$0.724

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218

$2.290

$0.990

$0.724

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Element14

Singapore . 2,664 parts In-Stock

1+ parts

$2.880

100+ parts

$1.270

1k+ parts

$0.904

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$0.886

2,664

$2.880

$1.270

$0.904

$0.886

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

-

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$0.548

5,000

-

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$0.548

Master Electronics

USA . 2,500 parts In-Stock

1+ parts

-

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$0.523

1k+ parts

$0.487

10k+ parts

$0.472

2,500

-

$0.523

$0.487

$0.472

Verical

USA . 17 parts In-Stock

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17

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Distributors (In-Stock)

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Nova Conductors

Japan . 83 parts In-Stock

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$0.731

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-

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83

$0.731

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Digiode

USA . 1,907 parts In-Stock

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$0.760

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1,907

$0.760

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Vyrian

USA . 28,821 parts In-Stock

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28,821

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Cyclops Electronics Ltd

UK . 25,625 parts In-Stock

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25,625

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Chip Stock

USA . 14,500 parts In-Stock

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14,500

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NAC Semi

USA . 5,000 parts In-Stock

1+ parts

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$1.890

5,000

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$1.890

ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

1+ parts

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2,500

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IBS Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.734

1k+ parts

$0.683

10k+ parts

$0.662

2,500

-

$0.734

$0.683

$0.662

ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Sensible Micro Corp

USA . 1,898 parts In-Stock

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1,898

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ACDS - Activité Composants Distribution Service

France . 280 parts In-Stock

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280

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Distributors (Availability)

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Ampacity Inc.

Singapore . 28,953 parts In-Stock

1+ parts

$0.466

100+ parts

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28,953

$0.466

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Semicontronic

India . 28,582 parts In-Stock

1+ parts

$0.466

100+ parts

$0.454

1k+ parts

$0.452

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28,582

$0.466

$0.454

$0.452

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Corohmni

South Africa . 405 parts In-Stock

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$0.524

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405

$0.524

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Continental Prestige Electronics

USA . 2,076 parts In-Stock

1+ parts

$0.713

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$0.699

2,076

$0.713

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$0.699

Argo Parts USA

USA . 1,024 parts In-Stock

1+ parts

$0.713

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$0.692

1,024

$0.713

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$0.692

Corphita

USA . 2,685 parts In-Stock

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$0.720

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2,685

$0.720

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.731

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$0.694

10k+ parts

$0.680

2,000

$0.731

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$0.694

$0.680

Aztec Data Supply Inc.

USA . 136 parts In-Stock

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$1.623

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136

$1.623

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Andel Nordic

Denmark . 431 parts In-Stock

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$3.978

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$3.819

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$3.819

431

$3.978

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$3.819

$3.819

Microchip USA

USA . 8,982 parts In-Stock

1+ parts

$4.215

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8,982

$4.215

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Perfect Parts

USA . 106,857 parts In-Stock

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Futuretech Components

Singapore . 15,000 parts In-Stock

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Lixinc

USA . 14,243 parts In-Stock

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Kulean Microsystems

USA . 8,053 parts In-Stock

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SupplyDigital Components

Austria . 7,292 parts In-Stock

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TANS Electronics

Latvia . 6,129 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Eastek

USA . 2,500 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Supply Digital

USA . 1,328 parts In-Stock

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Problanco Electronics

Mexico . 1,127 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 949 parts In-Stock

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949

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Glotronic Ltd.

UK . 224 parts In-Stock

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UHIMA Technologies

Türkiye . 104 parts In-Stock

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ChipstoGo Electronic ltd

UK . 24 parts In-Stock

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Overview

Enhance your power switching applications with the FDS89161LZ from Onsemi. Crafted from high-quality materials, this N-channel Power Field Effect Transistor offers superior performance and reliability. With a maximum operating temperature of 150°C and a compact rectangular package design, this transistor is ideal for a variety of industrial and consumer electronics. Experience the value and benefits of seamless switching operations with the FDS89161LZ, designed to deliver efficiency and precision in every application. Trust Onsemi for quality you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher switching speeds, making them ideal for high-performance applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for flexibility in circuit design and the built-in diode enhances efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient and reliable operation.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on printed circuit boards.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages without damage, ensuring robust performance.

Package Shape: RECTANGULAR

The rectangular shape is compact and space-saving, making it suitable for applications where size is a concern.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and provides mechanical stability for the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and higher efficiency in switching applications.

No. of Elements: 2

With two elements, this FET can handle more complex circuits and offer increased functionality.

Maximum Pulsed Drain Current (IDM): 15 A

The high pulsed drain current rating ensures the FET can handle peak loads without overheating.

Avalanche Energy Rating (EAS): 13 mJ

The high avalanche energy rating indicates the FET can withstand voltage spikes and transient events.

Maximum Drain Current (Abs) (ID): 2.7 A

With a maximum drain current of 2.7A, this FET can handle moderate power loads efficiently.

No. of Terminals: 8

With 8 terminals, this FET offers versatile connection options for different circuit configurations.

Maximum Power Dissipation (Abs): 31 W

The high power dissipation rating ensures the FET can handle significant power without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-state resistance for efficient performance.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon is a reliable and durable material for transistor elements, ensuring long-term performance and stability.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance for the FET terminals.

Maximum Drain-Source On Resistance: 0.105 ohm

The low on-resistance ensures minimal power loss and efficient operation of the FET.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and facilitate easy connections.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and reliability of the FET.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for proper soldering of the FET terminals, ensuring a strong connection.

Technical Specifications

Power Field Effect Transistors (FET) FDS89161LZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

13 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

2.7 A

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

.105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

15 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS89161LZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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