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FDS8896

Onsemi

FDS8896 by Onsemi

FDS8896 by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 110A IDM. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has a compact RECTANGULAR shape with GULL WING terminals.

Median Price

$0.393

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$0.281

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5

$0.281

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Mouser Electronics

USA . 2,822 parts In-Stock

1+ parts

$1.190

100+ parts

$0.493

1k+ parts

$0.347

10k+ parts

$0.294

2,822

$1.190

$0.493

$0.347

$0.294

DigiKey

USA . 14 parts In-Stock

1+ parts

$1.190

100+ parts

$0.493

1k+ parts

$0.347

10k+ parts

$0.273

14

$1.190

$0.493

$0.347

$0.273

Newark

USA . 2,600 parts In-Stock

1+ parts

$1.210

100+ parts

$0.500

1k+ parts

$0.447

10k+ parts

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2,600

$1.210

$0.500

$0.447

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Rochester

USA . 33,287 parts In-Stock

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-

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$0.349

1k+ parts

$0.290

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$0.258

33,287

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$0.349

$0.290

$0.258

Verical

USA . 15,000 parts In-Stock

1+ parts

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$0.393

10k+ parts

$0.323

15,000

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$0.393

$0.323

Avnet

USA . 10,000 parts In-Stock

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Element14

Singapore . 4,997 parts In-Stock

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$0.668

1k+ parts

$0.558

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4,997

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$0.668

$0.558

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RS (Exports)

UK . 2,490 parts In-Stock

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$0.308

2,490

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$0.308

Farnell

UK . 1,692 parts In-Stock

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$0.383

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$0.272

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1,692

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$0.383

$0.272

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Master Electronics

USA . 1,500 parts In-Stock

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$0.246

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$0.233

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$0.222

1,500

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$0.246

$0.233

$0.222

Chip1Stop

Japan . 1,385 parts In-Stock

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$0.462

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$0.289

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1,385

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$0.462

$0.289

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,070 parts In-Stock

1+ parts

$0.272

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2,070

$0.272

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Mobius Materials

USA . 12,478 parts In-Stock

1+ parts

$0.868

100+ parts

$0.696

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12,478

$0.868

$0.696

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NAC Semi

USA . 32,500 parts In-Stock

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$0.321

32,500

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$0.321

Vyrian

USA . 4,333 parts In-Stock

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4,333

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ComSIT Distribution GmbH

Germany . 1,875 parts In-Stock

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1,875

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Flip Electronics

USA . 1,760 parts In-Stock

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1,760

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Bristol Electronics

USA . 1,736 parts In-Stock

1+ parts

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$0.486

1k+ parts

$0.210

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1,736

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$0.486

$0.210

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Dan-Mar Components

USA . 1,736 parts In-Stock

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1,736

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IBS Electronics

USA . 1,500 parts In-Stock

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$0.345

1k+ parts

$0.326

10k+ parts

$0.312

1,500

-

$0.345

$0.326

$0.312

ACDS - Activité Composants Distribution Service

France . 634 parts In-Stock

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634

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Prism Electronics

USA . 437 parts In-Stock

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437

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PC Components Company LLC

USA . 378 parts In-Stock

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378

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Sea View Technologies

USA . 294 parts In-Stock

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Contempo Components LLC

USA . 273 parts In-Stock

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273

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Elcom Components

USA . 100 parts In-Stock

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100

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Nova Conductors

Japan . 77 parts In-Stock

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77

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,726 parts In-Stock

1+ parts

$0.207

100+ parts

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4,726

$0.207

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Corohmni

South Africa . 499 parts In-Stock

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$0.243

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499

$0.243

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Corphita

USA . 1,363 parts In-Stock

1+ parts

$0.257

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1,363

$0.257

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Component Stockers USA

USA . 25,607 parts In-Stock

1+ parts

$0.290

100+ parts

$0.270

1k+ parts

$0.250

10k+ parts

$0.250

25,607

$0.290

$0.270

$0.250

$0.250

Semicontronic

India . 4,750 parts In-Stock

1+ parts

$0.450

100+ parts

$0.439

1k+ parts

$0.436

10k+ parts

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4,750

$0.450

$0.439

$0.436

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Aztec Data Supply Inc.

USA . 1,601 parts In-Stock

1+ parts

$1.272

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1,601

$1.272

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Andel Nordic

Denmark . 2,697 parts In-Stock

1+ parts

$3.695

100+ parts

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1k+ parts

$3.547

10k+ parts

$3.547

2,697

$3.695

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$3.547

$3.547

Perfect Parts

USA . 114,908 parts In-Stock

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114,908

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Kepictronics

USA . 15,500 parts In-Stock

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15,500

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Problanco Electronics

Mexico . 6,872 parts In-Stock

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6,872

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Kulean Microsystems

USA . 6,386 parts In-Stock

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6,386

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,900 parts In-Stock

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$0.340

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4,900

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$0.340

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Lixinc

USA . 4,716 parts In-Stock

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4,716

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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SupplyDigital Components

Austria . 3,870 parts In-Stock

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3,870

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TANS Electronics

Latvia . 3,201 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,508 parts In-Stock

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Eastek

USA . 2,500 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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ChipstoGo Electronic ltd

UK . 780 parts In-Stock

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780

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UHIMA Technologies

Türkiye . 512 parts In-Stock

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512

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Argo Parts USA

USA . 402 parts In-Stock

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402

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Supply Digital

USA . 344 parts In-Stock

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344

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Bastille Electronics

Australia . 37 parts In-Stock

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Overview

Discover the power and reliability of the FDS8896 by Onsemi, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors. This N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering enhanced performance and efficiency. With a maximum pulsed drain current of 110A and a minimum DS breakdown voltage of 30V, this transistor provides exceptional value and benefits to customers seeking optimal performance in their electronic devices. Upgrade your designs with the FDS8896 and experience the advantages of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is commonly used in electronic components for its durability and resistance to heat and moisture, making this FET package reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher electron mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the circuit design and protects against reverse current flow, enhancing the overall efficiency and reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and high efficiency, making it suitable for power management and control systems.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, reducing space requirements and improving manufacturability of electronic devices.

Maximum Pulsed Drain Current (IDM): 110 A

With a high pulsed drain current rating, this FET can handle large surge currents and peak power demands, making it ideal for high-power applications.

Maximum Power Dissipation Ambient: 2.5 W

The FET's ability to dissipate up to 2.5W of power in ambient conditions ensures reliable performance and prevents overheating during operation.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance, ensuring stability in harsh environments.

Maximum Turn Off Time (toff): 126 ns

The fast turn-off time of 126 ns reduces switching losses and improves efficiency, making this FET suitable for high-frequency switching applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring a reliable connection between the FET and the PCB for long-term performance.

Technical Specifications

Power Field Effect Transistors (FET) FDS8896 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

196 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

300 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

2.5 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

110 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

126 ns

Maximum Turn On Time (ton):

68 ns

Trade Compliance

FDS8896 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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