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FDS4435A

Onsemi

FDS4435A by Onsemi

FDS4435A by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has 9A Drain Current, 0.017 ohm On Resistance, and can withstand temperatures from -55 to 150 °C.

Median Price

$1.558

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21,445 parts In-Stock

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-

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$1.530

1k+ parts

$1.270

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$1.130

21,445

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$1.530

$1.270

$1.130

Verical

USA . 20,960 parts In-Stock

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$1.587

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$1.413

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$1.587

$1.413

Farnell

UK . 1,080 parts In-Stock

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$1.226

1,080

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$1.226

DigiKey

USA . 230 parts In-Stock

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$1.910

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230

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$1.910

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Distributors (In-Stock)

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Digiode

USA . 1,577 parts In-Stock

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$1.026

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$1.026

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Nova Conductors

Japan . 48 parts In-Stock

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$1.121

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48

$1.121

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Bristol Electronics

USA . 18 parts In-Stock

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$2.100

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18

$2.100

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Component Electronics Inc.

Canada . 48 parts In-Stock

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$5.380

100+ parts

$4.040

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$3.500

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48

$5.380

$4.040

$3.500

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Chip Stock

USA . 65,000 parts In-Stock

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Vyrian

USA . 13,066 parts In-Stock

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13,066

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LIBRA Elektronik GmbH

Germany . 2,675 parts In-Stock

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2,675

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Rebound Electronics

UK . 1,640 parts In-Stock

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DigiKey Marketplace

USA . 1,080 parts In-Stock

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Prism Electronics

USA . 418 parts In-Stock

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418

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Semi Source

USA . 145 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 106 parts In-Stock

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ComSIT Distribution GmbH

Germany . 79 parts In-Stock

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ComSIT USA

USA . 79 parts In-Stock

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79

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Microfarads

USA . 59 parts In-Stock

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LWI Electronics Inc

India . 4 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 12,922 parts In-Stock

1+ parts

$0.920

100+ parts

$0.897

1k+ parts

$0.892

10k+ parts

-

12,922

$0.920

$0.897

$0.892

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Ampacity Inc.

Singapore . 12,806 parts In-Stock

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$0.920

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12,806

$0.920

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Corphita

USA . 2,894 parts In-Stock

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$0.972

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2,894

$0.972

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Component Stockers USA

USA . 38,005 parts In-Stock

1+ parts

$1.070

100+ parts

$0.680

1k+ parts

$1.110

10k+ parts

$1.110

38,005

$1.070

$0.680

$1.110

$1.110

Corohmni

South Africa . 205 parts In-Stock

1+ parts

$1.076

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205

$1.076

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Argo Parts USA

USA . 2,215 parts In-Stock

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$1.121

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Microchip USA

USA . 248 parts In-Stock

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$7.865

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248

$7.865

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Metaverse IC Inc.

Canada . 88,168 parts In-Stock

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Continental Prestige Electronics

USA . 27,028 parts In-Stock

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$1.510

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QUARKTWIN TECHNOLOGY LTD

USA . 13,321 parts In-Stock

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Perfect Parts

USA . 7,505 parts In-Stock

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TANS Electronics

Latvia . 5,116 parts In-Stock

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Kulean Microsystems

USA . 4,328 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Problanco Electronics

Mexico . 3,193 parts In-Stock

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Supply Digital

USA . 1,291 parts In-Stock

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SupplyDigital Components

Austria . 1,116 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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S.R.D Solutions

India . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 800 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$1.098

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$1.065

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$1.042

500

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$1.098

$1.065

$1.042

UHIMA Technologies

Türkiye . 124 parts In-Stock

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iodParts Technologies Inc.

India . 52 parts In-Stock

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Overview

Discover the power of the FDS4435A by Onsemi, a top-quality P-CHANNEL Small Signal Field Effect Transistor designed for switching applications. With its single configuration and built-in diode, this transistor offers enhanced performance and reliability. Perfect for a variety of electronic projects, this transistor is a game-changer in the industry. Experience seamless operation and increased efficiency with the FDS4435A. Choose Onsemi for cutting-edge technology and unparalleled value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for a variety of applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors typically have lower on-state resistance and higher mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and can protect the transistor from reverse voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in control circuits.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing production costs.

Minimum DS Breakdown Voltage: 30 V

Breakdown voltage of 30V provides a safety margin for switching high voltage loads.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing circuit layouts and designs.

Terminal Form: GULL WING

Gull wing terminals provide mechanical stability during soldering and handling, ensuring a reliable connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor switching behavior with a positive gate voltage.

No. of Terminals: 8

8 terminals provide flexibility in connecting the transistor in different circuit configurations.

Maximum Power Dissipation (Abs): 2.5 W

High power dissipation capability ensures the transistor can handle demanding switching applications without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for dense circuit layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low leakage current and high switching speeds for efficient performance.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the transistor to operate reliably in harsh environments without compromising performance.

Transistor Element Material: SILICON

Silicon material offers high breakdown voltage and low on-state resistance for efficient switching performance.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the transistor can perform reliably even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Maximum Drain Current (ID): 9 A

High maximum drain current rating allows the transistor to handle high current loads without overheating.

Maximum Drain-Source On Resistance: 0.017 ohm

Low on-resistance leads to minimal power loss and efficient operation in switching applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and connection options for different circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient soldering process during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for reliable solder joints even in lead-free soldering processes.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDS4435A attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS4435A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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