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FDS4435

Onsemi

FDS4435 by Onsemi

FDS4435 by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, 9A Drain Current, and 0.02 ohm On Resistance. Ideal for SWITCHING applications in ENHANCEMENT MODE, it comes in a RECTANGULAR package with GULL WING terminals and operates up to 175°C.

Median Price

$0.530

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

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Nova Conductors

Japan . 100 parts In-Stock

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$0.290

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Component Electronics Inc.

Canada . 15 parts In-Stock

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$0.770

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$0.580

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$0.770

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USA . 39,350 parts In-Stock

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Greenchips

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SIE Connect GmbH - GreenChips

Germany . 27,500 parts In-Stock

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PC Components Company LLC

USA . 12,475 parts In-Stock

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Vectronix, Inc

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Electronic Expediters

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Semi Source

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EMSNET

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ComSIT Distribution GmbH

Germany . 3,069 parts In-Stock

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ComSIT USA

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Digiode

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Odi Ramu Company

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First Choice Components Inc.

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

France . 1,933 parts In-Stock

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Prism Electronics

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Sea View Technologies

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Bristol Electronics

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Electronics Depot

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Vyrian

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Cyclops Electronics Ltd

UK . 978 parts In-Stock

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A2Z Electronics, Inc.

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Connector Distribution Corp

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Right Parts Inc.

USA . 120 parts In-Stock

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LWI Electronics Inc

India . 19 parts In-Stock

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Speed Components Ltd

Israel . 10 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 332 parts In-Stock

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$0.279

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332

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Continental Prestige Electronics

USA . 2,759 parts In-Stock

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$0.290

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$0.284

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Argo Parts USA

USA . 1,039 parts In-Stock

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$0.281

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Semicontronic

India . 358 parts In-Stock

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$3.050

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$2.974

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$2.958

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Andel Nordic

Denmark . 2,869 parts In-Stock

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AZTECH Wire

Italy . 601 parts In-Stock

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Ampacity Inc.

Singapore . 1,142 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 4,494 parts In-Stock

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Supply Digital

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SupplyDigital Components

Austria . 2,758 parts In-Stock

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Kulean Microsystems

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 1,000 parts In-Stock

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Computer Components Inc. - USA

USA . 746 parts In-Stock

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GreenTree Electronics

Israel . 537 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Corphita

USA . 459 parts In-Stock

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Futuretech Components

Singapore . 363 parts In-Stock

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TANS Electronics

Latvia . 275 parts In-Stock

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UHIMA Technologies

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Overview

Unlock the power of innovative technology with the FDS4435 by Onsemi. Crafted with precision and expertise, this P-CHANNEL transistor is designed for high-quality performance in switching applications. With a maximum drain current of 9A and a low on-resistance of 0.02 ohm, this small signal Field Effect Transistor offers exceptional value and reliability. Whether you're looking to enhance your circuit design or optimize power consumption, the FDS4435 delivers unmatched benefits and advantages. Upgrade your electronics with Onsemi's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, making it reliable for long-term use.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-resistance, making them suitable for high efficiency and low power consumption applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures fast switching speeds and efficient performance in various electronic circuits.

Maximum Drain Current (ID): 8.8 A

With a high maximum drain current, this transistor can handle large amounts of current flow, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 2.5 W

With a high power dissipation rating, this transistor can effectively dissipate heat generated during operation, ensuring reliable performance under heavy loads.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDS4435 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

8.8 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS4435 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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