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FDP18N20F

Onsemi

FDP18N20F by Onsemi

FDP18N20F by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage and 72A IDM. Ideal for SWITCHING applications, it features a built-in diode, 0.145 ohm RDS(on), and 100W Pdiss in a RECTANGULAR package.

Median Price

$1.406

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 139 parts In-Stock

1+ parts

$0.662

100+ parts

$0.623

1k+ parts

$0.563

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139

$0.662

$0.623

$0.563

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DigiKey

USA . 1,967 parts In-Stock

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$2.150

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1,967

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$2.150

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Flip Electronics (Authorized)

USA . 1,967 parts In-Stock

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1,967

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Digiode

USA . 2,725 parts In-Stock

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$0.629

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-

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2,725

$0.629

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Nova Conductors

Japan . 33 parts In-Stock

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$1.000

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33

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Flip Electronics

USA . 1,967 parts In-Stock

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1,967

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Vyrian

USA . 946 parts In-Stock

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946

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Chip Stock

USA . 148 parts In-Stock

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148

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Distributors (Availability)

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Ampacity Inc.

Singapore . 914 parts In-Stock

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$0.560

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914

$0.560

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Corphita

USA . 2,329 parts In-Stock

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$0.596

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2,329

$0.596

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Corohmni

South Africa . 207 parts In-Stock

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$0.662

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207

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RC Electronics

USA . 9,000 parts In-Stock

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Kulean Microsystems

USA . 8,370 parts In-Stock

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8,370

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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SupplyDigital Components

Austria . 4,896 parts In-Stock

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Supply Digital

USA . 2,698 parts In-Stock

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2,698

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TANS Electronics

Latvia . 2,299 parts In-Stock

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2,299

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Problanco Electronics

Mexico . 981 parts In-Stock

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981

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Netroflash

USA . 50 parts In-Stock

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$0.980

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$0.950

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$0.930

50

-

$0.980

$0.950

$0.930

iodParts Technologies Inc.

India . 15 parts In-Stock

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15

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UHIMA Technologies

Türkiye . 1 parts In-Stock

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Overview

Unlock the power of efficiency with the Onsemi FDP18N20F Power Field Effect Transistor. Designed by a trusted manufacturer, this N-CHANNEL device offers unparalleled quality and reliability for various switching applications. With a maximum pulsing drain current of 72A and a minimum DS breakdown voltage of 200V, this transistor delivers exceptional performance in a compact rectangular package. Say goodbye to inefficiency and hello to optimized power management with the FDP18N20F - the ultimate solution for all your power switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring reliable performance over time.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher current carrying capabilities compared to P-channel FETs, making them suitable for high-power applications.

Minimum DS Breakdown Voltage: 200 V

A high breakdown voltage allows the FET to handle high voltage applications, providing a wide range of use cases.

Maximum Power Dissipation (Abs): 100 W

The high power dissipation rating indicates that this FET can handle high power loads without overheating, ensuring stable operation under heavy loads.

Maximum Drain-Source On Resistance: 0.145 ohm

Low on-resistance results in minimal power loss and heat generation, making the FET efficient in conducting current and reducing energy waste.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring reliability in various operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDP18N20F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

324 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.145 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP18N20F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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