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FDP150N10

Onsemi

FDP150N10 by Onsemi

FDP150N10 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 228A and EAS of 132mJ, making it suitable for high-power tasks. With 0.015 ohm RDS(on) and 110W Pdiss, this MOSFET operates in ENHANCEMENT MODE at up to 150°C.

Median Price

$2.740

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 783 parts In-Stock

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$2.740

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$1.350

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$1.250

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783

$2.740

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DigiKey

USA . 476 parts In-Stock

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$2.740

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$1.357

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$1.091

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476

$2.740

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Verical

USA . 300 parts In-Stock

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Nova Conductors

Japan . 29 parts In-Stock

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$1.320

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Digiode

USA . 1,025 parts In-Stock

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$2.603

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Flip Electronics

USA . 3,200 parts In-Stock

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NAC Semi

USA . 1,600 parts In-Stock

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$1.770

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$1.630

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$1.630

Schukat

Germany . 980 parts In-Stock

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$1.594

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$1.366

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980

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Vyrian

USA . 348 parts In-Stock

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Euro-Tech

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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Corohmni

South Africa . 331 parts In-Stock

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$1.293

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Argo Parts USA

USA . 3,058 parts In-Stock

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$1.320

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Continental Prestige Electronics

USA . 2,486 parts In-Stock

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$1.320

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$1.293

2,486

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$1.293

Netroflash

USA . 1,000 parts In-Stock

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$1.320

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$1.320

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

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$1.584

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$1.584

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Ampacity Inc.

Singapore . 463 parts In-Stock

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$2.330

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463

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Corphita

USA . 1,116 parts In-Stock

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$2.466

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Microchip USA

USA . 2,462 parts In-Stock

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$17.745

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

USA . 37,746 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,727 parts In-Stock

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Assy Fe

Spain . 8,600 parts In-Stock

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Problanco Electronics

Mexico . 7,318 parts In-Stock

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TANS Electronics

Latvia . 5,408 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,961 parts In-Stock

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Alle Elektronik GmbH

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Kepictronics

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Kulean Microsystems

USA . 2,659 parts In-Stock

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RC Electronics

USA . 1,000 parts In-Stock

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S.R.D Solutions

India . 897 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 423 parts In-Stock

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GreenTree Electronics

Israel . 51 parts In-Stock

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SupplyDigital Components

Austria . 45 parts In-Stock

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Overview

Unleash the power of innovation with the FDP150N10 by Onsemi, a top-of-the-line Power Field Effect Transistor designed for switching applications. With a maximum pulsed drain current of 228A and an avalanche energy rating of 132mJ, this N-Channel transistor offers unparalleled performance and reliability. Manufactured with precision and expertise, Onsemi ensures that each FDP150N10 is built to last, delivering exceptional value and benefits to our customers. Whether you're looking to enhance your electronic designs or optimize power management, this transistor is the perfect solution for all your needs. Trust Onsemi for quality, trust FDP150N10 for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have higher conductivity and lower ON resistance, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 100 V

Can handle higher voltage levels, making it suitable for applications requiring a higher voltage tolerance.

Maximum Drain Current (ID): 57 A

Capable of handling high current loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 110 W

Has a high power dissipation rating, allowing it to handle high power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers fast switching speeds and low driving power requirements, making it suitable for high-frequency switching applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without impacting performance, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FDP150N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

132 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

57 A

Maximum Drain Current (ID):

57 A

Maximum Drain-Source On Resistance:

.015 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

228 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP150N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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