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FDP050AN06A0

Onsemi

FDP050AN06A0 by Onsemi

FDP050AN06A0 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 18A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.005 ohm On Resistance, and 245W Power Dissipation in a RECTANGULAR package.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 295 parts In-Stock

1+ parts

$3.090

100+ parts

$1.200

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$1.160

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295

$3.090

$1.200

$1.160

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Mouser Electronics

USA . 344 parts In-Stock

1+ parts

$3.680

100+ parts

$1.390

1k+ parts

-

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344

$3.680

$1.390

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DigiKey

USA . 4,443 parts In-Stock

1+ parts

$3.690

100+ parts

$1.690

1k+ parts

$1.280

10k+ parts

$1.215

4,443

$3.690

$1.690

$1.280

$1.215

Element14

Singapore . 295 parts In-Stock

1+ parts

$5.280

100+ parts

$2.050

1k+ parts

$1.980

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295

$5.280

$2.050

$1.980

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Chip1Stop

Japan . 690 parts In-Stock

1+ parts

$8.660

100+ parts

$3.720

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$2.730

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690

$8.660

$3.720

$2.730

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Master Electronics

USA . 900 parts In-Stock

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$1.450

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$1.250

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$1.160

900

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$1.450

$1.250

$1.160

Verical

USA . 600 parts In-Stock

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-

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$1.885

1k+ parts

$1.625

10k+ parts

$1.560

600

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$1.885

$1.625

$1.560

Avnet

USA . 400 parts In-Stock

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400

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Distributors (In-Stock)

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Vyrian

USA . 1,607 parts In-Stock

1+ parts

$1.450

100+ parts

-

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1,607

$1.450

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Digiode

USA . 1,308 parts In-Stock

1+ parts

$2.384

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1,308

$2.384

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Component Electronics Inc.

Canada . 2,690 parts In-Stock

1+ parts

$4.620

100+ parts

$3.460

1k+ parts

$3.000

10k+ parts

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2,690

$4.620

$3.460

$3.000

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Chip Stock

USA . 5,319 parts In-Stock

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NAC Semi

USA . 1,600 parts In-Stock

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$3.180

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$2.860

1,600

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$3.180

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$2.860

SPM Sales

USA . 630 parts In-Stock

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630

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Flip Electronics

USA . 630 parts In-Stock

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630

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IBS Electronics

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$1.820

1k+ parts

$1.586

10k+ parts

$1.482

600

-

$1.820

$1.586

$1.482

Sunrise Surplus Inc.

USA . 200 parts In-Stock

1+ parts

-

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200

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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150

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Inventory MP

USA . 30 parts In-Stock

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30

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Bristol Electronics

USA . 30 parts In-Stock

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30

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Electronics Depot

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,151 parts In-Stock

1+ parts

$1.230

100+ parts

-

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1,151

$1.230

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Corohmni

South Africa . 460 parts In-Stock

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$1.450

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460

$1.450

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Corphita

USA . 1,355 parts In-Stock

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$2.259

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1,355

$2.259

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Continental Prestige Electronics

USA . 223 parts In-Stock

1+ parts

$2.780

100+ parts

$1.460

1k+ parts

$1.100

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223

$2.780

$1.460

$1.100

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Microchip USA

USA . 7,972 parts In-Stock

1+ parts

$19.760

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7,972

$19.760

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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GreenTree Electronics

Israel . 42,400 parts In-Stock

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RC Electronics

USA . 31,840 parts In-Stock

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$1.480

1k+ parts

$1.350

10k+ parts

$1.310

31,840

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$1.480

$1.350

$1.310

QUARKTWIN TECHNOLOGY LTD

USA . 26,181 parts In-Stock

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Futuretech Components

Singapore . 18,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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TANS Electronics

Latvia . 4,395 parts In-Stock

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4,395

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,141 parts In-Stock

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3,141

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Supply Digital

USA . 2,539 parts In-Stock

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2,539

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Northwest PG Solutions

USA . 1,090 parts In-Stock

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1,090

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Kepictronics

USA . 800 parts In-Stock

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800

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Native Components

USA . 764 parts In-Stock

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764

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SupplyDigital Components

Austria . 491 parts In-Stock

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491

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Kulean Microsystems

USA . 433 parts In-Stock

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433

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UHIMA Technologies

Türkiye . 35 parts In-Stock

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Overview

Unlock the power of FDP050AN06A0 by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. Manufactured with precision by Onsemi, this N-CHANNEL transistor offers superior performance and reliability with a built-in diode for added convenience. With a maximum power dissipation of 245W and a minimum DS breakdown voltage of 60V, this transistor is ideal for various industrial and consumer electronics applications. Experience enhanced efficiency and durability with the FDP050AN06A0, delivering value and benefits to meet your unique needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and resistant to heat and moisture, making the FET durable and suitable for a variety of operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse voltage, enhancing the reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance, making it ideal for power control applications.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures that the FET can handle high voltage levels without breakdown, providing robust performance in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation, making the FET suitable for a wide range of electronic devices and systems.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and fast response times, making them ideal for switching applications where precise control is required.

Avalanche Energy Rating (EAS): 470 mJ

The high avalanche energy rating indicates that the FET can withstand high energy spikes, making it suitable for applications with inductive loads.

Maximum Drain Current (Abs) (ID): 18 A

The high maximum drain current rating allows the FET to handle high currents without overheating, ensuring reliable operation in high-power applications.

No. of Terminals: 3

The three terminals provide easy connections and allow for simple integration into electronic circuits, making the FET versatile and easy to use.

Maximum Power Dissipation (Abs): 245 W

The high power dissipation rating ensures that the FET can handle high power levels without overheating, making it suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting and effective heat dissipation, ensuring reliable performance in high-temperature environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making this FET a reliable choice for power control applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating allows the FET to operate reliably in high-temperature environments, ensuring consistent performance under varying conditions.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making this FET a durable choice for a wide range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance of the FET.

Maximum Drain-Source On Resistance: 0.005 ohm

The low on-resistance of the FET results in minimal power loss and high efficiency, making it ideal for power switching applications where low resistance is critical.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and installation, making the FET easy to integrate into electronic systems.

Case Connection: DRAIN

The drain connection allows for efficient heat dissipation and reliable current flow, ensuring stable performance of the FET even under high load conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDP050AN06A0 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

470 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP050AN06A0 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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