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FDP054N10

Onsemi

FDP054N10 by Onsemi

FDP054N10 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. It has a max IDM of 576A and EAS of 1153mJ, suitable for SWITCHING applications. Operating in ENHANCEMENT MODE, it offers 0.0055 ohm RDS(on) and can handle up to 263W power dissipation at 175°C.

Median Price

$5.060

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,036 parts In-Stock

1+ parts

$5.060

100+ parts

$2.640

1k+ parts

$2.400

10k+ parts

-

1,036

$5.060

$2.640

$2.400

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DigiKey

USA . 437 parts In-Stock

1+ parts

$5.950

100+ parts

$2.880

1k+ parts

-

10k+ parts

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437

$5.950

$2.880

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Chip1Stop

Japan . 800 parts In-Stock

1+ parts

$16.000

100+ parts

$7.200

1k+ parts

$5.380

10k+ parts

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800

$16.000

$7.200

$5.380

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Rochester

USA . 1,077 parts In-Stock

1+ parts

-

100+ parts

$2.410

1k+ parts

$2.160

10k+ parts

$2.030

1,077

-

$2.410

$2.160

$2.030

Verical

USA . 855 parts In-Stock

1+ parts

-

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$2.700

10k+ parts

$2.538

855

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$2.700

$2.538

Distributors (In-Stock)

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Digiode

USA . 1,683 parts In-Stock

1+ parts

$2.546

100+ parts

-

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1,683

$2.546

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Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$3.206

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35

$3.206

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Flip Electronics

USA . 1,000 parts In-Stock

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1,000

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Vyrian

USA . 455 parts In-Stock

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455

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ACDS - Activité Composants Distribution Service

France . 392 parts In-Stock

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392

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Bristol Electronics

USA . 392 parts In-Stock

1+ parts

-

100+ parts

$1.999

1k+ parts

$1.756

10k+ parts

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392

-

$1.999

$1.756

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Dan-Mar Components

USA . 392 parts In-Stock

1+ parts

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392

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Cyclops Electronics Ltd

UK . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 586 parts In-Stock

1+ parts

$2.280

100+ parts

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586

$2.280

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Corphita

USA . 1,255 parts In-Stock

1+ parts

$2.412

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1,255

$2.412

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Corohmni

South Africa . 192 parts In-Stock

1+ parts

$2.680

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192

$2.680

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Argo Parts USA

USA . 3,918 parts In-Stock

1+ parts

$3.206

100+ parts

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3,918

$3.206

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Continental Prestige Electronics

USA . 2,630 parts In-Stock

1+ parts

$3.206

100+ parts

-

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10k+ parts

$3.141

2,630

$3.206

-

-

$3.141

Component Stockers USA

USA . 1,628 parts In-Stock

1+ parts

$4.970

100+ parts

$3.150

1k+ parts

-

10k+ parts

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1,628

$4.970

$3.150

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

USA . 43,210 parts In-Stock

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43,210

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Microchip USA

USA . 10,693 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,139 parts In-Stock

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RC Electronics

USA . 9,534 parts In-Stock

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100+ parts

$3.100

1k+ parts

$2.830

10k+ parts

$2.750

9,534

-

$3.100

$2.830

$2.750

Kepictronics

USA . 9,000 parts In-Stock

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SupplyDigital Components

Austria . 8,291 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,401 parts In-Stock

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TANS Electronics

Latvia . 5,490 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,259 parts In-Stock

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3,259

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Problanco Electronics

Mexico . 2,957 parts In-Stock

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2,957

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Kulean Microsystems

USA . 2,953 parts In-Stock

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Supply Digital

USA . 2,459 parts In-Stock

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2,459

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Lixinc

USA . 1,315 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 220 parts In-Stock

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220

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Overview

Enhance the performance of your electronic devices with the FDP054N10 Power Field Effect Transistor from Onsemi. With a reputation for top-notch quality and reliability, Onsemi delivers cutting-edge technology in the form of this N-CHANNEL transistor. Ideal for switching applications, this single configuration transistor comes with a built-in diode for added convenience. Experience the benefits of enhanced power efficiency and seamless operation with the FDP054N10, offering a maximum drain current of 120A and a low drain-source on resistance of 0.0055 ohm. Upgrade your devices today and enjoy the superior performance that Onsemi products bring to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from voltage spikes that can occur during switching events.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON-resistance for efficient power control.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle higher voltage levels, making it suitable for high-power applications.

Maximum Pulsed Drain Current (IDM): 576 A

The high pulsed drain current rating allows the FET to handle large current surges without damage, ensuring reliability in demanding conditions.

Avalanche Energy Rating (EAS): 1153 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient events, enhancing overall robustness.

Maximum Power Dissipation (Abs): 263 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable operation in high-power applications.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to perform reliably in elevated temperature environments, offering versatility in various applications.

Technical Specifications

Power Field Effect Transistors (FET) FDP054N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

1153 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

144 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

576 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP054N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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