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FDMC6686P

Onsemi

FDMC6686P by Onsemi

FDMC6686P by Onsemi is a P-CHANNEL Power FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features 56A Drain Current, 0.004 ohm On Resistance, and 40W Power Dissipation in a SQUARE package. Operating from -55 to 150 °C, it has fast turn-on/off times of 162/791 ns and a peak reflow temp of 260C.

Median Price

$0.896

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,122 parts In-Stock

1+ parts

$2.800

100+ parts

$1.237

1k+ parts

$0.916

10k+ parts

$0.935

8,122

$2.800

$1.237

$0.916

$0.935

Verical

USA . 4,200 parts In-Stock

1+ parts

-

100+ parts

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$0.896

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-

4,200

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-

$0.896

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Rochester

USA . 169 parts In-Stock

1+ parts

-

100+ parts

$0.825

1k+ parts

$0.684

10k+ parts

$0.610

169

-

$0.825

$0.684

$0.610

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 26,560 parts In-Stock

1+ parts

$0.650

100+ parts

-

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26,560

$0.650

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DF Sales Co.

USA . 26,560 parts In-Stock

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$0.650

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26,560

$0.650

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Digiode

USA . 3,205 parts In-Stock

1+ parts

$0.801

100+ parts

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3,205

$0.801

-

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Nova Conductors

Japan . 42 parts In-Stock

1+ parts

$1.089

100+ parts

-

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42

$1.089

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Maritex

Poland . 91 parts In-Stock

1+ parts

$2.440

100+ parts

$1.473

1k+ parts

$1.242

10k+ parts

-

91

$2.440

$1.473

$1.242

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Chip Stock

USA . 165,600 parts In-Stock

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165,600

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Vyrian

USA . 2,776 parts In-Stock

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2,776

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Flip Electronics

USA . 2,048 parts In-Stock

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2,048

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ComSIT Distribution GmbH

Germany . 862 parts In-Stock

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862

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SPM Sales

USA . 672 parts In-Stock

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672

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Prism Electronics

USA . 13 parts In-Stock

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13

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Distributors (Availability)

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Corohmni

South Africa . 437 parts In-Stock

1+ parts

$0.650

100+ parts

-

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437

$0.650

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Ampacity Inc.

Singapore . 2,254 parts In-Stock

1+ parts

$0.720

100+ parts

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2,254

$0.720

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Corphita

USA . 2,507 parts In-Stock

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$0.759

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2,507

$0.759

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Perfect Parts

USA . 36,385 parts In-Stock

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36,385

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Kepictronics

USA . 30,000 parts In-Stock

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30,000

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QUARKTWIN TECHNOLOGY LTD

USA . 22,409 parts In-Stock

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22,409

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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22,000

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SupplyDigital Components

Austria . 7,857 parts In-Stock

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7,857

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Problanco Electronics

Mexico . 7,792 parts In-Stock

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TANS Electronics

Latvia . 7,268 parts In-Stock

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Supply Digital

USA . 2,286 parts In-Stock

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Lixinc

USA . 1,572 parts In-Stock

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UHIMA Technologies

Türkiye . 947 parts In-Stock

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947

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Kulean Microsystems

USA . 832 parts In-Stock

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Metaverse IC Inc.

Canada . 300 parts In-Stock

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300

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Overview

Unlock the power of innovation with the FDMC6686P by Onsemi. Crafted with precision and superior quality, this P-Channel Power Field Effect Transistor offers unmatched performance for switching applications. With a single configuration and built-in diode, it delivers reliable results with a maximum drain current of 56A. Ideal for enhancing your projects, this transistor's small outline package and matte tin finish ensure easy installation and longevity. Embrace efficiency and reliability with the FDMC6686P - the perfect solution for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high input impedance, making them suitable for efficient switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in preventing reverse current flow and protecting the circuit from damage.

Transistor Application: SWITCHING

Designed for high-speed switching applications, offering fast turn-on and turn-off times.

Surface Mount: YES

Easy to mount on circuit boards, saving space and providing a secure connection.

Maximum Drain Current (ID): 56 A

Capable of handling high current loads, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 40 W

With a high power dissipation rating, this FET can handle significant power levels without overheating.

Maximum Operating Temperature: 150 °C

Can operate reliably at high temperatures, suitable for demanding industrial environments.

Maximum Turn Off Time (toff): 791 ns

Fast turn-off time minimizes power losses and improves efficiency in switching operations.

Maximum Feedback Capacitance (Crss): 2010 pF

Low feedback capacitance helps in reducing signal distortion and improving overall circuit performance.

Technical Specifications

Power Field Effect Transistors (FET) FDMC6686P attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

56 A

Maximum Drain Current (ID):

56 A

Maximum Drain-Source On Resistance:

.004 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

2010 pF

JEDEC-95 Code:

MO-240BA

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

377 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

791 ns

Maximum Turn On Time (ton):

162 ns

Trade Compliance

FDMC6686P Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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