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FDH047AN08A0

Onsemi

FDH047AN08A0 by Onsemi

FDH047AN08A0 by Onsemi is a N-CHANNEL Power FET with 75V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 80A, 0.0047 ohm Drain-Source Resistance, and 475mJ Avalanche Energy Rating. This METAL-OXIDE SEMICONDUCTOR transistor operates in ENHANCEMENT MODE at up to 175 °C temperature.

Median Price

$5.959

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1k+

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Arrow

USA . 450 parts In-Stock

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$4.268

100+ parts

$3.539

1k+ parts

$3.243

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450

$4.268

$3.539

$3.243

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DigiKey

USA . 398 parts In-Stock

1+ parts

$7.650

100+ parts

$4.424

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$3.229

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398

$7.650

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Mouser Electronics

USA . 175 parts In-Stock

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$7.650

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$7.650

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Chip1Stop

Japan . 450 parts In-Stock

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$8.100

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$4.080

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$3.670

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450

$8.100

$4.080

$3.670

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Flip Electronics (Authorized)

USA . 4,481 parts In-Stock

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Verical

USA . 450 parts In-Stock

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$3.399

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$3.115

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450

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$3.399

$3.115

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Rochester

USA . 31 parts In-Stock

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$3.230

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$2.890

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$2.720

31

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$2.720

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Digiode

USA . 1,193 parts In-Stock

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$3.410

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Vyrian

USA . 484 parts In-Stock

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$3.568

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Chip Stock

USA . 4,500 parts In-Stock

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USA . 2,881 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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50

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Native Components

USA . 299 parts In-Stock

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$0.539

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299

$0.539

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Northwest PG Solutions

USA . 732 parts In-Stock

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$0.592

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$0.592

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Corphita

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$3.231

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Corohmni

South Africa . 446 parts In-Stock

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$3.568

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446

$3.568

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Component Stockers USA

USA . 687 parts In-Stock

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$3.620

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$4.260

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687

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Microchip USA

USA . 6,628 parts In-Stock

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$18.256

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Metaverse IC Inc.

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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A-Z Elektronik GmbH

Germany . 6,818 parts In-Stock

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TANS Electronics

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UHIMA Technologies

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Perfect Parts

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Kepictronics

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Overview

Upgrade your power management systems with the FDH047AN08A0 by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. Manufactured by industry leader Onsemi, this N-channel transistor offers a single configuration with a built-in diode, enhancing efficiency and performance. With a maximum drain current of 80A and a low drain-source on resistance of 0.0047 ohm, this transistor ensures optimal power dissipation and operation at temperatures up to 175 °C. Trust in Onsemi's expertise and unlock the potential of your electronic devices with the FDH047AN08A0.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the transistor reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance characteristics compared to P-channel transistors, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and helps in protecting the transistor from back EMF, making it convenient and efficient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high performance and efficiency in controlling currents.

Minimum DS Breakdown Voltage: 75 V

The high breakdown voltage allows the transistor to handle high voltages without damage, ensuring reliability in various operating conditions.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and integrate into different circuit designs, offering flexibility in product development.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections to the circuit board, ensuring stability and reliability in the overall system.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over the transistor's conductivity, making it suitable for a wide range of applications.

Avalanche Energy Rating (EAS): 475 mJ

The high avalanche energy rating indicates the transistor's ability to withstand high-energy pulses, making it suitable for demanding environments.

Maximum Drain Current (Abs) (ID): 15 A

With a high maximum drain current rating, this transistor can handle large current flows without overheating, ensuring stable performance.

No. of Terminals: 3

The three terminals provide easy connectivity in the circuit, enabling efficient operation and integration in different electronic systems.

Maximum Power Dissipation (Abs): 310 W

The high power dissipation rating allows the transistor to handle high power levels without damage, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy mounting and heat dissipation, ensuring optimal performance in various operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in transistor operation, making this product a reliable choice for various applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this transistor can operate reliably in high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high performance and reliability, making this product a durable choice for long-term use.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and ensures reliable connections, contributing to the overall durability of the transistor.

Maximum Drain Current (ID): 80 A

With a high maximum drain current rating, this transistor can handle large current flows with ease, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.0047 ohm

The low drain-source on resistance minimizes power losses and improves efficiency, making this transistor ideal for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection, making it easy to integrate the transistor into different circuit designs.

Case Connection: DRAIN

The drain case connection enhances thermal management and helps dissipate heat effectively, ensuring reliable performance in various operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDH047AN08A0 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

475 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0047 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDH047AN08A0 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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