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FDD120AN15A0-F085

Onsemi

FDD120AN15A0-F085 by Onsemi

FDD120AN15A0-F085 by Onsemi is a N-CHANNEL power field effect transistor (FET) with a min DS breakdown voltage of 150V. It is designed for switching applications and has a max drain current of 14A. This surface mount transistor operates in enhancement mode and has a max power dissipation of 65W.

Median Price

$0.624

Lifecycle Status

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6

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1k+

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Rochester

USA . 2,221 parts In-Stock

1+ parts

$0.624

100+ parts

$0.586

1k+ parts

$0.530

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2,221

$0.624

$0.586

$0.530

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Digiode

USA . 2,298 parts In-Stock

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$0.593

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Nova Conductors

Japan . 128 parts In-Stock

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$1.090

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128

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Chip Stock

USA . 8,336 parts In-Stock

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Vyrian

USA . 5,889 parts In-Stock

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Flip Electronics

USA . 2,800 parts In-Stock

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Semicontronic

India . 3,949 parts In-Stock

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$0.530

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$0.517

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$0.514

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3,949

$0.530

$0.517

$0.514

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Ampacity Inc.

Singapore . 3,822 parts In-Stock

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$0.530

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Corphita

USA . 1,449 parts In-Stock

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$0.562

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Corohmni

South Africa . 378 parts In-Stock

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$0.624

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378

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Bastille Electronics

Australia . 800 parts In-Stock

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$1.090

100+ parts

$1.036

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$0.984

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$0.970

800

$1.090

$1.036

$0.984

$0.970

Continental Prestige Electronics

USA . 9,668 parts In-Stock

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$1.090

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$1.068

9,668

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$1.068

Argo Parts USA

USA . 7,614 parts In-Stock

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$1.090

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Netroflash

USA . 100 parts In-Stock

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$1.090

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Microchip USA

USA . 3,561 parts In-Stock

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$4.126

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AZTECH Wire

Italy . 567 parts In-Stock

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$17.650

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Kepictronics

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Authorized Procurement Solutions

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Problanco Electronics

Mexico . 5,494 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Supply Digital

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SupplyDigital Components

Austria . 393 parts In-Stock

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UHIMA Technologies

Türkiye . 112 parts In-Stock

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Overview

Discover the FDD120AN15A0-F085, a high-quality Power Field Effect Transistor (FET) by Onsemi. With its robust construction and advanced technology, this N-CHANNEL transistor offers unmatched performance for switching applications. Its single configuration with a built-in diode ensures hassle-free installation. Designed for enhanced efficiency, it maximizes power dissipation while operating at temperatures up to 175°C. Delivering a minimum breakdown voltage of 150V and a maximum drain current of 14A, this FET is perfect for demanding projects. Trust Onsemi's expertise and choose the FDD120AN15A0-F085 for superior reliability, exceptional power handling, and unrivaled performance. Maximize your project's potential with this cutting-edge FET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures the product's durability and resistance to physical damage, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for fast and efficient switching, enhancing the performance of the product.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit designs and improves efficiency by eliminating the need for external components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this product provides excellent control and reliability in electronic circuits.

Surface Mount: YES

The surface mount feature enables easy and efficient assembly on circuit boards, saving valuable space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 150 V

The high voltage rating ensures reliable and safe operation, making this product suitable for a wide range of voltage applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient utilization of space on circuit boards, enabling compact and streamlined designs.

Terminal Form: GULL WING

The gull wing terminal form provides strong electrical connections, making the product reliable and resistant to mechanical stress.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation guarantees good performance and control by allowing for effective modulation of the transistor's conducting characteristics.

No. of Elements: 1

With a single element, this product simplifies circuit designs and reduces complexity, making it easier to integrate into various systems.

Avalanche Energy Rating (EAS): 122 mJ

The high avalanche energy rating ensures the product's ability to withstand high-energy transients, thus enhancing its overall ruggedness and reliability.

Maximum Drain Current (Abs) (ID): 14 A

The high maximum drain current rating allows for efficient power handling and enables the product to operate under demanding conditions.

No. of Terminals: 2

With only two terminals, this product offers simplified connections, reducing the chances of errors during installation or assembly.

Maximum Power Dissipation (Abs): 65 W

The high power dissipation rating ensures the ability to handle substantial power levels without compromising performance or reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards, allowing for more compact designs and enabling integration in space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology ensures high-speed switching and low power consumption, making this product a suitable choice for energy-efficient applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating enables reliable operation even in elevated temperature environments, enhancing the product's versatility and endurance.

Transistor Element Material: SILICON

Silicon, being a widely used semiconductor material, ensures excellent electrical properties and reliability, making this product a reliable choice for various applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature rating allows the product to function reliably in extreme cold conditions, expanding its range of possible applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and improved electrical conductivity, ensuring secure connections and consistent performance.

Maximum Drain-Source On Resistance: 0.12 ohm

The low on-resistance minimizes power loss and provides effective control over the transistor's operation, enhancing the efficiency of the product.

Terminal Position: SINGLE

With a single terminal position, this product simplifies installation and assembly, reducing the chances of misalignment or connection errors.

Moisture Sensitivity Level (MSL): 1

The low moisture sensitivity level ensures the product's resistance to moisture-induced failures, making it suitable for a wide range of operating conditions.

Case Connection: DRAIN

The drain case connection enhances the product's electrical performance and simplifies power distribution in circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The high maximum time at peak reflow temperature allows operation within specified reflow profiles, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature rating ensures the product's compatibility with common soldering processes, facilitating assembly and integration into electronic devices.

Reference Standard: AEC-Q101

The adherence to the AEC-Q101 standard ensures the product's reliability and suitability for automotive applications, making it a dependable choice for automotive electronics.

Technical Specifications

Power Field Effect Transistors (FET) FDD120AN15A0-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

122 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD120AN15A0-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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