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FDD10N20LZTM

Onsemi

FDD10N20LZTM by Onsemi

FDD10N20LZTM by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage and 30A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.38 ohm RDS(on), and 56W Pdiss in a small outline package.

Median Price

$0.351

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,092 parts In-Stock

1+ parts

$0.351

100+ parts

$0.330

1k+ parts

$0.298

10k+ parts

$0.298

2,092

$0.351

$0.330

$0.298

$0.298

Distributors (In-Stock)

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Digiode

USA . 2,964 parts In-Stock

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$0.333

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2,964

$0.333

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Vyrian

USA . 2,277 parts In-Stock

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$0.351

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2,277

$0.351

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Bristol Electronics

USA . 20 parts In-Stock

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$1.875

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20

$1.875

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Chip Stock

USA . 4,000 parts In-Stock

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MISTER SPROCKETS

USA . 356 parts In-Stock

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356

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Contempo Components LLC

USA . 95 parts In-Stock

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Velocity Electronics

USA . 29 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 143 parts In-Stock

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$0.316

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143

$0.316

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Corohmni

South Africa . 59 parts In-Stock

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$0.351

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59

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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TANS Electronics

Latvia . 8,380 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,945 parts In-Stock

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SupplyDigital Components

Austria . 6,457 parts In-Stock

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Kulean Microsystems

USA . 6,104 parts In-Stock

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Perfect Parts

USA . 5,771 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Supply Digital

USA . 1,423 parts In-Stock

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Problanco Electronics

Mexico . 1,200 parts In-Stock

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Northwest PG Solutions

USA . 1,143 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 669 parts In-Stock

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669

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Native Components

USA . 499 parts In-Stock

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499

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Microchip USA

USA . 443 parts In-Stock

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443

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Overview

Power up your projects with the FDD10N20LZTM Power Field Effect Transistor by Onsemi. Known for their high-quality components, Onsemi delivers reliable products that are perfect for a variety of switching applications. This N-CHANNEL transistor features a single configuration with a built-in diode, making it a versatile choice for your projects. With a minimum DS breakdown voltage of 200V and a maximum pulsed drain current of 30A, this transistor offers exceptional performance and efficiency. Trust Onsemi to provide you with the tools you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for long-lasting performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with built-in diode for improved functionality.

Transistor Application: SWITCHING

Ideal for switching applications, providing efficient operation.

Surface Mount: YES

Easy to mount on PCBs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 200 V

High breakdown voltage for reliable operation in various conditions.

Maximum Power Dissipation (Abs): 56 W

High power dissipation capability for handling heavy loads.

Maximum Operating Temperature: 150 °C

Can operate effectively at high temperatures, increasing versatility.

Technical Specifications

Power Field Effect Transistors (FET) FDD10N20LZTM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

121 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

7.6 A

Maximum Drain Current (ID):

7.6 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD10N20LZTM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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