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FDD10AN06A0-F085

Onsemi

FDD10AN06A0-F085 by Onsemi

Onsemi's FDD10AN06A0-F085 is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring 50A Drain Current, 0.0105 ohm On Resistance, and 135W Power Dissipation, it operates in ENHANCEMENT MODE. With a temperature range of -55 to 175 °C, this MOSFET is suitable for automotive (AEC-Q101) and industrial use.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,770 parts In-Stock

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Digiode

USA . 1,494 parts In-Stock

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Nova Conductors

Japan . 249 parts In-Stock

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AZTECH Wire

Italy . 1,312 parts In-Stock

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$18.724

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$18.724

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Ampacity Inc.

Singapore . 1,136 parts In-Stock

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$42.050

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QUARKTWIN TECHNOLOGY LTD

USA . 18,749 parts In-Stock

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TANS Electronics

Latvia . 8,083 parts In-Stock

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Perfect Parts

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Kulean Microsystems

USA . 4,467 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Corphita

USA . 2,992 parts In-Stock

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Problanco Electronics

Mexico . 1,941 parts In-Stock

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UHIMA Technologies

Türkiye . 955 parts In-Stock

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Supply Digital

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SupplyDigital Components

Austria . 640 parts In-Stock

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Corohmni

South Africa . 309 parts In-Stock

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Aranea Global

USA . 150 parts In-Stock

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Overview

Unleash the power of innovative technology with the FDD10AN06A0-F085 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that excel in switching applications. This N-CHANNEL transistor offers unparalleled performance and reliability, with a single configuration featuring a built-in diode for added convenience. From its high DS Breakdown Voltage to its low Drain-Source On Resistance, this transistor is designed to optimize efficiency and deliver exceptional results. Discover the value and benefits of the FDD10AN06A0-F085 by Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers better efficiency and performance compared to P-channel FETs, making it suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space with the integrated diode, enhancing overall functionality.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance and efficient operation.

Minimum DS Breakdown Voltage: 60 V

Can handle high voltage applications, providing a reliable and safe solution for various electronic systems.

Package Shape: RECTANGULAR

Facilitates easier integration into circuit boards and allows for efficient use of space within the system.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and lower gate current requirements, improving efficiency and performance.

Avalanche Energy Rating (EAS): 429 mJ

Withstands high-energy transients, ensuring the FET can handle sudden voltage spikes without damage.

Maximum Drain Current (Abs) (ID): 50 A

Capable of handling high currents, making it suitable for power applications that require efficient current flow.

Maximum Power Dissipation (Abs): 135 W

Provides efficient heat dissipation capabilities, allowing the FET to sustain high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Uses advanced MOSFET technology for enhanced performance and reliability in various applications.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without experiencing performance degradation, ensuring reliability in challenging conditions.

Minimum Operating Temperature: -55 °C

Capable of functioning in low-temperature environments, making it versatile for a wide range of operating conditions.

Maximum Drain-Source On Resistance: 0.0105 ohm

Low on-resistance minimizes power losses and improves efficiency in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD10AN06A0-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

429 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD10AN06A0-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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