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FDD10N20LZ

Onsemi

FDD10N20LZ by Onsemi

FDD10N20LZ by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 30A and EAS of 121mJ, operating in ENHANCEMENT MODE at up to 150 °C. This PLASTIC/EPOXY transistor has 0.38 ohm RDS(on) and DRAIN connection in GULL WING package style.

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Native Components

USA . 48 parts In-Stock

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$86.057

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Northwest PG Solutions

USA . 1,681 parts In-Stock

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SupplyDigital Components

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TANS Electronics

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Problanco Electronics

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Assy Fe

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UHIMA Technologies

Türkiye . 935 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi with the FDD10N20LZ Power Field Effect Transistor. This N-CHANNEL transistor offers unparalleled performance in switching applications, making it ideal for a wide range of projects. With a maximum pulsed drain current of 30A and a minimum breakdown voltage of 200V, this transistor provides exceptional power handling capabilities. Trust in Onsemi's expertise and innovation to elevate your next design with the FDD10N20LZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used for switching applications and offer good performance in various circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the functionality of the FET and makes it suitable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers efficient and reliable performance.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer low on-resistance and high current capability for efficient switching operations.

Maximum Pulsed Drain Current (IDM): 30 A

The high maximum pulsed drain current rating allows for reliable operation in high-power applications.

Avalanche Energy Rating (EAS): 121 mJ

The high avalanche energy rating ensures reliable performance under transient conditions and protects the FET from voltage spikes.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit design and makes the FET easy to integrate into applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs in electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, fast switching speed, and low power consumption in FETs.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures and harsh environmental conditions.

Transistor Element Material: SILICON

Silicon transistor elements provide high performance and reliability in various circuit applications.

Maximum Drain Current (ID): 7.6 A

The high maximum drain current rating ensures reliable performance in high-power switching circuits.

Maximum Drain-Source On Resistance: 0.38 ohm

The low drain-source on resistance minimizes power loss and improves efficiency in switching operations.

Terminal Position: SINGLE

Having a single terminal position simplifies the circuit layout and installation process.

Case Connection: DRAIN

The drain case connection enhances heat dissipation and ensures optimal performance of the FET in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD10N20LZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

121 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

7.6 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD10N20LZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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