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FDB42AN15A0-F085

Onsemi

FDB42AN15A0-F085 by Onsemi

FDB42AN15A0-F085 by Onsemi is a N-CHANNEL Power FET with 150V DS Breakdown Voltage and 35A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.042 ohm On Resistance, and operates in ENHANCEMENT MODE. Suitable for high-power requirements in automotive and industrial electronics.

Median Price

$0.980

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 51 parts In-Stock

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$0.980

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$0.960

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$0.940

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51

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$0.940

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Vyrian

USA . 8,658 parts In-Stock

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Digiode

USA . 868 parts In-Stock

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868

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Nova Conductors

Japan . 250 parts In-Stock

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AZTECH Wire

Italy . 1,556 parts In-Stock

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$10.607

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Ampacity Inc.

Singapore . 2,459 parts In-Stock

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$51.050

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TANS Electronics

Latvia . 8,375 parts In-Stock

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SupplyDigital Components

Austria . 7,033 parts In-Stock

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Continental Prestige Electronics

USA . 5,968 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Problanco Electronics

Mexico . 2,603 parts In-Stock

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Kulean Microsystems

USA . 1,570 parts In-Stock

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Argo Parts USA

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Corphita

USA . 1,304 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 566 parts In-Stock

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Corohmni

South Africa . 318 parts In-Stock

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Bastille Electronics

Australia . 132 parts In-Stock

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Overview

Enhance your power switching applications with the FDB42AN15A0-F085 by Onsemi. Crafted with precision using top-notch metal-oxide semiconductor technology, this N-channel power field effect transistor offers a breakthrough in performance and reliability. Designed for single with built-in diode configuration, this transistor is perfect for a wide range of industrial and automotive applications. With a maximum drain current of 35 A and a low drain-source on resistance of 0.042 ohm, this transistor delivers exceptional power dissipation and efficiency. Trust Onsemi's reputation for quality and innovation, and elevate your projects to new heights with the FDB42AN15A0-F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing overall weight of the product, making it suitable for applications where weight is a concern.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making this product a good choice for applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit from reverse current flow, providing added reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient power handling capabilities.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and cost during production.

Minimum DS Breakdown Voltage: 150 V

The high breakdown voltage ensures reliable performance in high voltage applications, making it a versatile choice for various electronic systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and performance, making this FET suitable for demanding applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand harsh environmental conditions, enhancing its durability and longevity.

Technical Specifications

Power Field Effect Transistors (FET) FDB42AN15A0-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

78 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

35 A

Maximum Drain Current (ID):

35 A

Maximum Drain-Source On Resistance:

.042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB42AN15A0-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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