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FCP650N80Z

Onsemi

FCP650N80Z by Onsemi

FCP650N80Z by Onsemi is a N-CHANNEL Power FET with 800V DS Breakdown Voltage. It features 24A IDM, 204mJ EAS, and 0.65 ohm RDS(ON). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max temp of 150°C.

Median Price

$1.700

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 104 parts In-Stock

1+ parts

$1.372

100+ parts

-

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104

$1.372

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Adafruit Industries

USA . 1,000 parts In-Stock

1+ parts

$1.770

100+ parts

$1.629

1k+ parts

$1.526

10k+ parts

-

1,000

$1.770

$1.629

$1.526

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Chip1Stop

Japan . 104 parts In-Stock

1+ parts

$2.020

100+ parts

-

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104

$2.020

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Farnell

UK . 9,908 parts In-Stock

1+ parts

$2.500

100+ parts

$1.860

1k+ parts

$1.400

10k+ parts

-

9,908

$2.500

$1.860

$1.400

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Flip Electronics (Authorized)

USA . 2,802 parts In-Stock

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2,802

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Rochester

USA . 1,954 parts In-Stock

1+ parts

-

100+ parts

$1.290

1k+ parts

$1.160

10k+ parts

$1.090

1,954

-

$1.290

$1.160

$1.090

DigiKey

USA . 1,954 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.700

10k+ parts

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1,954

-

-

$1.700

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Verical

USA . 1,032 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.450

10k+ parts

$1.363

1,032

-

-

$1.450

$1.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,257 parts In-Stock

1+ parts

$1.321

100+ parts

-

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3,257

$1.321

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Chip Stock

USA . 26,000 parts In-Stock

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26,000

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DigiKey Marketplace

USA . 4,800 parts In-Stock

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4,800

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Vyrian

USA . 3,107 parts In-Stock

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3,107

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Flip Electronics

USA . 2,802 parts In-Stock

1+ parts

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2,802

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,047 parts In-Stock

1+ parts

$0.621

100+ parts

-

1k+ parts

-

10k+ parts

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4,047

$0.621

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Ampacity Inc.

Singapore . 3,344 parts In-Stock

1+ parts

$1.180

100+ parts

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3,344

$1.180

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Semicontronic

India . 3,127 parts In-Stock

1+ parts

$1.180

100+ parts

$1.150

1k+ parts

$1.145

10k+ parts

-

3,127

$1.180

$1.150

$1.145

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Corphita

USA . 657 parts In-Stock

1+ parts

$1.252

100+ parts

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657

$1.252

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Corohmni

South Africa . 132 parts In-Stock

1+ parts

$1.391

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132

$1.391

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Component Stockers USA

USA . 2,361 parts In-Stock

1+ parts

$1.530

100+ parts

$1.440

1k+ parts

$1.300

10k+ parts

-

2,361

$1.530

$1.440

$1.300

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$1.770

100+ parts

$1.629

1k+ parts

$1.526

10k+ parts

-

1,000

$1.770

$1.629

$1.526

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Continental Prestige Electronics

USA . 4,800 parts In-Stock

1+ parts

$2.500

100+ parts

$1.860

1k+ parts

-

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4,800

$2.500

$1.860

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Microchip USA

USA . 215 parts In-Stock

1+ parts

$9.490

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215

$9.490

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TANS Electronics

Latvia . 8,356 parts In-Stock

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8,356

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Kulean Microsystems

USA . 7,634 parts In-Stock

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SupplyDigital Components

Austria . 7,046 parts In-Stock

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Argo Parts USA

USA . 3,603 parts In-Stock

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Problanco Electronics

Mexico . 3,375 parts In-Stock

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Supply Digital

USA . 1,140 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 652 parts In-Stock

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652

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Overview

Unleash the power of innovation with the FCP650N80Z by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor is designed for optimal performance in switching applications. Its single configuration with built-in diode offers unmatched reliability, while the high-quality materials ensure long-lasting durability. From enhancing efficiency to maximizing output, this transistor delivers exceptional value and benefits to customers across various industries. Elevate your projects with the FCP650N80Z and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent insulation and protection for the transistor, ensuring long-term reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have higher mobility and conductivity, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient energy transfer and reverse current protection in the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient on/off transitions.

Minimum DS Breakdown Voltage: 800 V

High breakdown voltage allows for operation in high voltage circuits without risk of damage.

Maximum Pulsed Drain Current (IDM): 24 A

Capable of handling high current pulses, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 162 W

Can dissipate high power levels without overheating, ensuring reliable performance under heavy loads.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments without performance degradation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high switching speeds and low gate drive power requirements for efficient operation.

Maximum Turn Off Time (toff): 107 ns

Fast turn off time allows for quick switching and reduces power loss during transitions.

Technical Specifications

Power Field Effect Transistors (FET) FCP650N80Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

204 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.65 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

24 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

107 ns

Maximum Turn On Time (ton):

76 ns

Trade Compliance

FCP650N80Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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