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FCP600N60Z

Onsemi

FCP600N60Z by Onsemi

The Onsemi FCP600N60Z is a N-CHANNEL Power FET with 7.4A max drain current and 89W power dissipation. Ideal for high-power applications, it operates up to 150°C, featuring METAL-OXIDE SEMICONDUCTOR tech and matte tin finish for robust performance.

Median Price

$1.413

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 781 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.130

10k+ parts

$1.010

781

-

$1.360

$1.130

$1.010

DigiKey

USA . 781 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.700

10k+ parts

-

781

-

-

$1.700

-

Verical

USA . 781 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.262

781

-

-

$1.413

$1.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 566 parts In-Stock

1+ parts

$0.877

100+ parts

-

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566

$0.877

-

-

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Digiode

USA . 1,951 parts In-Stock

1+ parts

$1.064

100+ parts

-

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1,951

$1.064

-

-

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Flip Electronics

USA . 800 parts In-Stock

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800

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Distributors (Availability)

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Corohmni

South Africa . 196 parts In-Stock

1+ parts

$0.877

100+ parts

-

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196

$0.877

-

-

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Corphita

USA . 205 parts In-Stock

1+ parts

$1.008

100+ parts

-

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205

$1.008

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Native Components

USA . 671 parts In-Stock

1+ parts

$1.600

100+ parts

-

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671

$1.600

-

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Northwest PG Solutions

USA . 1,480 parts In-Stock

1+ parts

$1.760

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1,480

$1.760

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,304 parts In-Stock

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11,304

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A-Z Elektronik GmbH

Germany . 6,848 parts In-Stock

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6,848

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TANS Electronics

Latvia . 5,870 parts In-Stock

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5,870

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Alle Elektronik GmbH

Germany . 4,565 parts In-Stock

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4,565

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Kulean Microsystems

USA . 3,261 parts In-Stock

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3,261

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Microchip USA

USA . 2,893 parts In-Stock

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2,893

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SupplyDigital Components

Austria . 2,506 parts In-Stock

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2,506

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Problanco Electronics

Mexico . 1,873 parts In-Stock

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1,873

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Supply Digital

USA . 1,639 parts In-Stock

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1,639

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Continental Prestige Electronics

USA . 781 parts In-Stock

1+ parts

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$1.340

1k+ parts

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781

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$1.340

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Perfect Parts

USA . 752 parts In-Stock

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752

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UHIMA Technologies

Türkiye . 155 parts In-Stock

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155

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Kepictronics

USA . 90 parts In-Stock

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90

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Overview

Unleash the power of innovation with the FCP600N60Z by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) like no other. With its N-CHANNEL design and high performance capabilities, this transistor is perfect for a wide range of applications. From increasing efficiency to enhancing overall functionality, the FCP600N60Z offers unparalleled value and benefits to customers looking to elevate their projects to the next level. Trust Onsemi to deliver cutting-edge solutions that exceed expectations every time.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL FETs generally have better performance characteristics compared to P-CHANNEL FETs, making them a good choice for many applications.

Configuration

SINGLE configuration makes the FET easier to control and integrate into circuits, simplifying the design process.

Maximum Drain Current (Abs) (ID)

High maximum drain current rating of 7.4 A allows this FET to handle higher power loads, making it suitable for applications requiring high current capabilities.

Maximum Power Dissipation (Abs)

High maximum power dissipation rating of 89 W ensures that the FET can efficiently handle power without overheating, enhancing its reliability.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR technology offers improved performance and efficiency compared to traditional FET technologies, making this FET a reliable choice.

Maximum Operating Temperature

High maximum operating temperature of 150°C allows this FET to operate reliably in demanding environments without risk of overheating.

Terminal Finish

Matte Tin terminal finish provides good electrical conductivity and corrosion resistance, ensuring stable performance of the FET over time.

Maximum Drain Current (ID)

With a maximum drain current of 7.4 A, this FET can handle high current loads efficiently, making it suitable for various power applications.

Technical Specifications

Power Field Effect Transistors (FET) FCP600N60Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

7.4 A

Maximum Drain Current (ID):

7.4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

FCP600N60Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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