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FCP36N60N

Onsemi

FCP36N60N by Onsemi

FCP36N60N by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 108A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and operates in ENHANCEMENT MODE. This RECTANGULAR package has a max power dissipation of 312W and can handle up to 36A drain current.

Median Price

$7.310

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 101 parts In-Stock

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$8.186

100+ parts

$6.617

1k+ parts

$6.303

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101

$8.186

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$6.303

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DigiKey

USA . 3,739 parts In-Stock

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$7.310

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Flip Electronics (Authorized)

USA . 3,739 parts In-Stock

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Rochester

USA . 452 parts In-Stock

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$4.920

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$4.400

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$4.140

452

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$4.920

$4.400

$4.140

Distributors (In-Stock)

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Nova Conductors

Japan . 26 parts In-Stock

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$4.974

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Digiode

USA . 1,169 parts In-Stock

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$5.196

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Flip Electronics

USA . 3,739 parts In-Stock

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Vyrian

USA . 1,900 parts In-Stock

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1,900

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ComSIT Distribution GmbH

Germany . 1,019 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Ampacity Inc.

Singapore . 1,915 parts In-Stock

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$4.650

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$4.650

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Corohmni

South Africa . 482 parts In-Stock

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$4.875

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$4.875

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Corphita

USA . 2,357 parts In-Stock

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$4.923

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$4.923

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Continental Prestige Electronics

USA . 3,810 parts In-Stock

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$4.974

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$4.875

3,810

$4.974

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$4.875

Netroflash

USA . 500 parts In-Stock

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$4.974

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$4.725

10k+ parts

$4.626

500

$4.974

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$4.725

$4.626

Component Stockers USA

USA . 1,385 parts In-Stock

1+ parts

$5.610

100+ parts

$5.270

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Perfect Parts

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Lixinc

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A-Z Elektronik GmbH

Germany . 11,376 parts In-Stock

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TANS Electronics

Latvia . 7,880 parts In-Stock

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Kulean Microsystems

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 4,084 parts In-Stock

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Argo Parts USA

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SupplyDigital Components

Austria . 2,798 parts In-Stock

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Problanco Electronics

Mexico . 537 parts In-Stock

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UHIMA Technologies

Türkiye . 477 parts In-Stock

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Overview

Unlock the power of efficiency with the FCP36N60N by Onsemi. Crafted with precision and quality, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance for switching applications. With a robust design and high breakdown voltage of 600V, this transistor is a game-changer in the field. Experience seamless operation and enhanced reliability with the built-in diode configuration. Trust Onsemi's expertise to deliver superior products that exceed expectations. Elevate your projects with the FCP36N60N and witness the difference in performance and durability it brings.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher efficiency compared to P-Channel FETs, making this product suitable for high performance applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltages and provide reliable protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 108 A

The high pulsed drain current rating allows this FET to handle large current spikes and surges without damage, making it suitable for heavy-duty applications.

Maximum Power Dissipation (Abs): 312 W

The high power dissipation rating ensures that this FET can handle high power levels without overheating, making it reliable for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate effectively in high temperature environments, providing reliable performance under challenging conditions.

Technical Specifications

Power Field Effect Transistors (FET) FCP36N60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1800 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

36 A

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCP36N60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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