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FCP11N60N-F102

Onsemi

FCP11N60N-F102 by Onsemi

FCP11N60N-F102 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It has a Max IDM of 32.4A and EAS of 201.7mJ, ideal for SWITCHING applications. Operating in ENHANCEMENT MODE, it offers 0.299 ohm RDS(on) and can handle up to 94W power dissipation at temperatures ranging from -55 to 150 °C.

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Lifecycle Status

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1k+

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Vyrian

USA . 7,670 parts In-Stock

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Digiode

USA . 1,943 parts In-Stock

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AZTECH Wire

Italy . 253 parts In-Stock

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$21.140

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QUARKTWIN TECHNOLOGY LTD

USA . 22,675 parts In-Stock

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TANS Electronics

Latvia . 6,877 parts In-Stock

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SupplyDigital Components

Austria . 6,511 parts In-Stock

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Kulean Microsystems

USA . 5,752 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 2,078 parts In-Stock

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Corphita

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Northwest PG Solutions

USA . 903 parts In-Stock

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Kepictronics

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Corohmni

South Africa . 370 parts In-Stock

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Native Components

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UHIMA Technologies

Türkiye . 174 parts In-Stock

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Overview

Enhance your power applications with the FCP11N60N-F102 by Onsemi. This high-quality N-channel Power FET offers outstanding performance and reliability, making it ideal for various switching functions. With a maximum pulsed drain current of 32.4A and a minimum DS breakdown voltage of 600V, this transistor is designed to handle demanding tasks with ease. Whether you're working on industrial equipment or consumer electronics, this single configuration FET with a built-in diode provides exceptional value and efficiency. Trust Onsemi's expertise in semiconductor technology and elevate your projects to new heights with the FCP11N60N-F102.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and conductivity, making them more efficient for switching applications.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows for the FET to handle high voltage applications without failing.

Maximum Drain Current (ID): 10.8 A

The high maximum drain current rating makes this FET suitable for applications that require high current handling capabilities.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and typically have lower on-resistance, making them more efficient in switching applications.

Maximum Power Dissipation (Abs): 94 W

The high power dissipation rating allows the FET to handle high power loads without overheating.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the FET to operate reliably in harsh environmental conditions.

Maximum Drain-Source On Resistance: 0.299 ohm

The low on-resistance results in lower power losses and higher efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FCP11N60N-F102 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

201.7 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10.8 A

Maximum Drain Current (ID):

10.8 A

Maximum Drain-Source On Resistance:

.299 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32.4 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

124 ns

Maximum Turn On Time (ton):

65.4 ns

Trade Compliance

FCP11N60N-F102 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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