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FCP11N60N

Onsemi

FCP11N60N by Onsemi

FCP11N60N by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It has a Max Pulsed Drain Current of 32.4A and Avalanche Energy Rating of 201.7mJ, ideal for SWITCHING applications. Operating in ENHANCEMENT MODE, it offers a Max Power Dissipation of 94W and can handle up to 10.8A Drain Current efficiently.

Median Price

$1.675

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 50 parts In-Stock

1+ parts

$0.497

100+ parts

$0.452

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$0.408

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-

50

$0.497

$0.452

$0.408

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Farnell

UK . 726 parts In-Stock

1+ parts

$2.743

100+ parts

$2.351

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$2.200

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726

$2.743

$2.351

$2.200

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Rochester

USA . 1,700 parts In-Stock

1+ parts

-

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$1.500

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$1.340

10k+ parts

$1.260

1,700

-

$1.500

$1.340

$1.260

DigiKey

USA . 1,700 parts In-Stock

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$1.980

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$1.980

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Verical

USA . 900 parts In-Stock

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$1.675

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$1.575

900

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$1.675

$1.575

Flip Electronics (Authorized)

USA . 790 parts In-Stock

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Digiode

USA . 572 parts In-Stock

1+ parts

$0.472

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-

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572

$0.472

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Vyrian

USA . 734 parts In-Stock

1+ parts

$0.497

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734

$0.497

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Flip Electronics

USA . 790 parts In-Stock

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790

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Native Components

USA . 998 parts In-Stock

1+ parts

$0.435

100+ parts

-

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-

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$0.418

998

$0.435

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-

$0.418

Corphita

USA . 1,244 parts In-Stock

1+ parts

$0.447

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1,244

$0.447

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Northwest PG Solutions

USA . 1,033 parts In-Stock

1+ parts

$0.478

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$0.422

1,033

$0.478

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-

$0.422

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$0.497

100+ parts

$0.452

1k+ parts

$0.408

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50

$0.497

$0.452

$0.408

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Corohmni

South Africa . 265 parts In-Stock

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$1.570

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265

$1.570

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Continental Prestige Electronics

USA . 8,800 parts In-Stock

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$2.170

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$1.860

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$2.170

$1.860

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,640 parts In-Stock

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Lixinc

USA . 13,047 parts In-Stock

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A-Z Elektronik GmbH

Germany . 12,458 parts In-Stock

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Kulean Microsystems

USA . 7,585 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,805 parts In-Stock

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SupplyDigital Components

Austria . 4,549 parts In-Stock

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TANS Electronics

Latvia . 2,481 parts In-Stock

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Supply Digital

USA . 1,995 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 1,054 parts In-Stock

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Perfect Parts

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Kepictronics

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UHIMA Technologies

Türkiye . 54 parts In-Stock

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XScomponents

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Overview

Experience the power and reliability of the FCP11N60N by Onsemi, a top-of-the-line Power Field Effect Transistor (FET) designed for switching applications. With a single configuration and built-in diode, this N-channel transistor offers unparalleled performance and efficiency. Benefit from its maximum drain current of 10.8 A and high power dissipation of 94 W, making it ideal for a wide range of industrial and electronic applications. Trust in Onsemi's reputation for quality and innovation, and elevate your projects with the FCP11N60N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material makes the transistor lightweight and resistant to environmental factors, increasing its durability and reliability.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this transistor can handle high voltage applications, making it suitable for a variety of power switching solutions.

Maximum Pulsed Drain Current (IDM): 32.4 A

The high pulsed drain current capability allows for handling short-term high-power loads, making it ideal for applications that require high current pulses.

Maximum Power Dissipation (Abs): 94 W

The high power dissipation rating enables the transistor to handle high power densities without overheating, ensuring reliable operation under heavy load conditions.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for the transistor to operate in challenging thermal environments, providing flexibility in application usage.

Technical Specifications

Power Field Effect Transistors (FET) FCP11N60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

201.7 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10.8 A

Maximum Drain Current (ID):

10.8 A

Maximum Drain-Source On Resistance:

.299 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

124 ns

Maximum Turn On Time (ton):

65.4 ns

Trade Compliance

FCP11N60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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