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FCP099N65S3

Onsemi

FCP099N65S3 by Onsemi

FCP099N65S3 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage and 30A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 145mJ Avalanche Energy Rating, and 0.099 ohm On Resistance. Operating in ENHANCEMENT MODE, this transistor can handle up to 75A Pulsed Drain Current efficiently.

Median Price

$5.925

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,590 parts In-Stock

1+ parts

$2.010

100+ parts

-

1k+ parts

-

10k+ parts

-

1,590

$2.010

-

-

-

Rochester

USA . 800 parts In-Stock

1+ parts

$3.070

100+ parts

$2.880

1k+ parts

$2.610

10k+ parts

-

800

$3.070

$2.880

$2.610

-

Newark

USA . 1,307 parts In-Stock

1+ parts

$5.510

100+ parts

$3.400

1k+ parts

$2.760

10k+ parts

-

1,307

$5.510

$3.400

$2.760

-

Mouser Electronics

USA . 999 parts In-Stock

1+ parts

$6.340

100+ parts

$3.200

1k+ parts

$3.040

10k+ parts

-

999

$6.340

$3.200

$3.040

-

DigiKey

USA . 453 parts In-Stock

1+ parts

$6.550

100+ parts

$3.192

1k+ parts

$2.627

10k+ parts

-

453

$6.550

$3.192

$2.627

-

Element14

Singapore . 1,590 parts In-Stock

1+ parts

$7.770

100+ parts

$5.630

1k+ parts

$4.060

10k+ parts

-

1,590

$7.770

$5.630

$4.060

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,254 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,254

$1.910

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.332

100+ parts

-

1k+ parts

-

10k+ parts

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50

$4.332

-

-

-

Chip Stock

USA . 7,150 parts In-Stock

1+ parts

-

100+ parts

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7,150

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-

-

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Vyrian

USA . 895 parts In-Stock

1+ parts

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100+ parts

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895

-

-

-

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NAC Semi

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$5.950

1k+ parts

$5.490

10k+ parts

-

250

-

$5.950

$5.490

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 762 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

-

10k+ parts

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762

$1.710

-

-

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Corphita

USA . 354 parts In-Stock

1+ parts

$1.809

100+ parts

-

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354

$1.809

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-

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Corohmni

South Africa . 199 parts In-Stock

1+ parts

$2.010

100+ parts

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199

$2.010

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.332

100+ parts

$4.245

1k+ parts

-

10k+ parts

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2,000

$4.332

$4.245

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-

Microchip USA

USA . 3,072 parts In-Stock

1+ parts

$16.520

100+ parts

-

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3,072

$16.520

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Perfect Parts

USA . 135,632 parts In-Stock

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135,632

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Kepictronics

USA . 65,600 parts In-Stock

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65,600

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RC Electronics

USA . 32,479 parts In-Stock

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32,479

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-

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Authorized Procurement Solutions

USA . 20,030 parts In-Stock

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20,030

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Problanco Electronics

Mexico . 7,157 parts In-Stock

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7,157

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Kulean Microsystems

USA . 6,948 parts In-Stock

1+ parts

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6,948

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TANS Electronics

Latvia . 6,826 parts In-Stock

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6,826

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Lixinc

USA . 2,432 parts In-Stock

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2,432

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UHIMA Technologies

Türkiye . 636 parts In-Stock

1+ parts

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636

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SupplyDigital Components

Austria . 450 parts In-Stock

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450

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iodParts Technologies Inc.

India . 10 parts In-Stock

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10

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Overview

Unleash the power of innovation with the FCP099N65S3 by Onsemi, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors. Designed for switching applications, this N-CHANNEL transistor offers unmatched performance and reliability. Its single configuration with a built-in diode ensures seamless operation, while its impressive 650V breakdown voltage guarantees safety and durability. Experience enhanced efficiency and precision with this cutting-edge semiconductor technology. Elevate your projects to new heights with the FCP099N65S3 and unlock limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and better performance compared to P-Channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient and efficient switching applications.

Transistor Application: SWITCHING

Designed specifically for efficient switching operations.

Minimum DS Breakdown Voltage: 650 V

Can handle high voltage applications with ease.

Maximum Pulsed Drain Current (IDM): 75 A

Capable of handling high current pulses effectively.

Maximum Power Dissipation (Abs): 227 W

High power dissipation capability ensures reliable performance under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable and efficient semiconductor technology for high-performance applications.

Maximum Operating Temperature: 150 °C

Can operate effectively in high-temperature environments.

Minimum Operating Temperature: -55 °C

Can operate in a wide range of temperature conditions.

Maximum Drain-Source On Resistance: 0.099 ohm

Low ON resistance minimizes power loss and improves efficiency.

Technical Specifications

Power Field Effect Transistors (FET) FCP099N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

145 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

75 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCP099N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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