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FCH47N60F-F085

Onsemi

FCH47N60F-F085 by Onsemi

FCH47N60F-F085 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 47A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.075 ohm RDS(on), and 417W Power Dissipation in a RECTANGULAR package.

Median Price

$14.370

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 378 parts In-Stock

1+ parts

$18.130

100+ parts

$13.820

1k+ parts

$11.480

10k+ parts

$10.680

378

$18.130

$13.820

$11.480

$10.680

Flip Electronics (Authorized)

USA . 1,216 parts In-Stock

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Rochester

USA . 397 parts In-Stock

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$11.200

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$10.020

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$9.430

397

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$11.200

$10.020

$9.430

DigiKey

USA . 397 parts In-Stock

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$14.740

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397

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$14.740

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Verical

USA . 397 parts In-Stock

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$14.000

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$12.525

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$11.787

397

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$14.000

$12.525

$11.787

Distributors (In-Stock)

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Digiode

USA . 498 parts In-Stock

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$11.846

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498

$11.846

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Vyrian

USA . 1,803 parts In-Stock

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$12.470

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1,803

$12.470

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Flip Electronics

USA . 1,216 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 390 parts In-Stock

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390

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Bristol Electronics

USA . 390 parts In-Stock

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390

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Dan-Mar Components

USA . 390 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 843 parts In-Stock

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$11.223

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843

$11.223

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Corohmni

South Africa . 438 parts In-Stock

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$12.470

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438

$12.470

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Microchip USA

USA . 2,472 parts In-Stock

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$50.260

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$50.260

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,885 parts In-Stock

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SupplyDigital Components

Austria . 7,614 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,524 parts In-Stock

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Kulean Microsystems

USA . 5,699 parts In-Stock

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TANS Electronics

Latvia . 4,480 parts In-Stock

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Problanco Electronics

Mexico . 3,385 parts In-Stock

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Supply Digital

USA . 2,886 parts In-Stock

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Northwest PG Solutions

USA . 2,308 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,116 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Native Components

USA . 785 parts In-Stock

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UHIMA Technologies

Türkiye . 704 parts In-Stock

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Perfect Parts

USA . 497 parts In-Stock

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Continental Prestige Electronics

USA . 397 parts In-Stock

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Overview

Unleash the power of innovation with the FCH47N60F-F085 by Onsemi. Manufactured with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance in switching applications. With a breakthrough design and cutting-edge technology, this N-CHANNEL transistor provides reliability and efficiency like never before. Whether you're in automotive, industrial, or consumer electronics, this product is sure to exceed your expectations. Elevate your projects with the value and benefits that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the internal components of the FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used for higher power applications due to their lower ON resistance, making this product suitable for switching purposes.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from voltage spikes and reverse current flow, enhancing the reliability of the switching operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast response times, making it ideal for power control applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications without the risk of breakdown, ensuring reliable performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various circuit designs, making it a versatile component for different applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, making it easier to solder and secure the FET in place for stable operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the switching operation, providing high efficiency and low power consumption in the circuit.

Avalanche Energy Rating (EAS): 810 mJ

The high avalanche energy rating ensures the FET can withstand sudden energy spikes, making it a robust choice for demanding applications.

Maximum Drain Current (Abs) (ID): 47 A

With a high maximum drain current capacity, this FET can handle significant power loads, making it suitable for high current switching applications.

No. of Terminals: 3

Having 3 terminals allows for easy integration into existing circuit designs, providing flexibility in connecting the FET to other components.

Maximum Power Dissipation (Abs): 417 W

The high maximum power dissipation rating ensures the FET can handle high power loads without overheating, ensuring long-term reliability.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and heat dissipation capabilities, making it suitable for applications where thermal management is crucial.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good performance characteristics in terms of speed, efficiency, and reliability, making this FET a solid choice for various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate reliably in demanding environments without the risk of overheating, ensuring consistent performance.

Transistor Element Material: SILICON

Silicon is a common material used in FETs due to its high thermal conductivity and electrical properties, making this product a reliable choice for different applications.

Maximum Drain-Source On Resistance: 0.075 ohm

The low ON resistance of the drain-source path helps minimize power loss and improve efficiency in the switching operation, making it an ideal choice for high power applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection process and ensures proper alignment during installation, making it easier to integrate into the circuit design.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard indicates that this FET meets automotive industry requirements for reliability and durability, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FCH47N60F-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

810 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

47 A

Maximum Drain Current (ID):

47 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCH47N60F-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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