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ESDL2031MX4T5G

Onsemi

ESDL2031MX4T5G by Onsemi

ESDL2031MX4T5G by Onsemi is a single transient suppression device with a max power dissipation of 72W. It features a breakdown voltage of 6.8V and a bidirectional polarity, making it ideal for protecting electronic circuits from voltage spikes in applications such as consumer electronics and industrial equipment.

Median Price

$0.049

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9,151 parts In-Stock

1+ parts

$0.290

100+ parts

$0.075

1k+ parts

$0.067

10k+ parts

-

9,151

$0.290

$0.075

$0.067

-

DigiKey

USA . 46,404 parts In-Stock

1+ parts

$0.320

100+ parts

$0.121

1k+ parts

$0.079

10k+ parts

$0.061

46,404

$0.320

$0.121

$0.079

$0.061

Verical

USA . 3,700,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.036

3,700,000

-

-

-

$0.036

Flip Electronics (Authorized)

USA . 1,491,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,491,090

-

-

-

-

Rochester

USA . 904,529 parts In-Stock

1+ parts

-

100+ parts

$0.049

1k+ parts

$0.040

10k+ parts

$0.036

904,529

-

$0.049

$0.040

$0.036

Future Electronics

Canada . 220,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.040

220,000

-

-

-

$0.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 656 parts In-Stock

1+ parts

$0.038

100+ parts

-

1k+ parts

-

10k+ parts

-

656

$0.038

-

-

-

Vyrian

USA . 1,331 parts In-Stock

1+ parts

$0.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,331

$0.040

-

-

-

Flip Electronics

USA . 2,231,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,231,090

-

-

-

-

IBS Electronics

USA . 690,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.056

690,000

-

-

-

$0.056

NAC Semi

USA . 350,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.080

350,000

-

-

-

$0.080

Chip Stock

USA . 64,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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64,000

-

-

-

-

Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,505 parts In-Stock

1+ parts

$0.036

100+ parts

-

1k+ parts

-

10k+ parts

-

1,505

$0.036

-

-

-

Corohmni

South Africa . 245 parts In-Stock

1+ parts

$0.040

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$0.040

-

-

-

Native Components

USA . 187 parts In-Stock

1+ parts

$155.260

100+ parts

-

1k+ parts

-

10k+ parts

$149.050

187

$155.260

-

-

$149.050

Northwest PG Solutions

USA . 709 parts In-Stock

1+ parts

$170.786

100+ parts

-

1k+ parts

-

10k+ parts

-

709

$170.786

-

-

-

Continental Prestige Electronics

USA . 190,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.048

10k+ parts

-

190,000

-

-

$0.048

-

Metaverse IC Inc.

Canada . 100,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100,000

-

-

-

-

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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25,000

-

-

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TANS Electronics

Latvia . 6,095 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,095

-

-

-

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Kulean Microsystems

USA . 4,876 parts In-Stock

1+ parts

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100+ parts

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4,876

-

-

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Problanco Electronics

Mexico . 4,021 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,021

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-

-

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SupplyDigital Components

Austria . 2,916 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,916

-

-

-

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Lixinc

USA . 2,579 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,579

-

-

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UHIMA Technologies

Türkiye . 202 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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202

-

-

-

-

Overview

Enhance your electronic devices with the ESDL2031MX4T5G by Onsemi, a top-tier transient suppression device designed to protect your equipment from voltage spikes and surges. Manufactured by Onsemi, a trusted leader in the industry, this product offers superior quality and reliability. Ideal for a wide range of applications, this single configuration chip carrier is a must-have for any electronics enthusiast. Experience peace of mind knowing that your devices are safeguarded with the ESDL2031MX4T5G, providing unmatched value, benefits, and advantages for all customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for various applications.

Config: SINGLE

Single configuration simplifies installation and maintenance, reducing complexity in system design.

Surface Mount: YES

Surface mount design allows for easy and quick integration onto PCBs, saving space and enabling high-density layouts.

Maximum Non-Repetitive Peak Reverse Power Dissipation: 72 W

High power dissipation capability ensures protection against transient overvoltages, enhancing the reliability of connected components.

Nominal Breakdown Voltage: 6.8 V

The nominal breakdown voltage ensures effective voltage clamping, safeguarding sensitive electronics from damage.

Maximum Reverse Current: 0.05 uA

Low reverse current ensures minimal power loss and helps maintain the efficiency of the transient suppression device.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy mounting and alignment during assembly, enhancing overall product usability.

Reverse Test Voltage: 4 V

The reverse test voltage indicates the device's ability to handle reverse voltage conditions, ensuring reliable performance in real-world scenarios.

No. of Terminals: 2

Having only 2 terminals simplifies connection and reduces potential points of failure, enhancing overall system reliability.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compact size and efficient heat dissipation, making it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions, increasing product versatility.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for reliable operation even in extreme cold environments, enhancing product durability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process.

Minimum Breakdown Voltage: 5.1 V

The minimum breakdown voltage ensures effective protection against transient voltage spikes, safeguarding connected circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at the peak reflow temperature indicates the device's capability to withstand soldering processes, ensuring reliable performance during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for lead-free soldering processes, making the product environmentally friendly and compliant with industry regulations.

Maximum Breakdown Voltage: 8.5 V

High maximum breakdown voltage offers increased protection against transient overvoltages, enhancing the device's reliability in demanding operating conditions.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Compliance with IEC standards ensures the product meets industry requirements for transient suppression devices, guaranteeing reliable performance and quality.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of trans voltage suppressor diode technology provides efficient voltage clamping and fast response times, effectively protecting connected systems from voltage spikes.

Technology: AVALANCHE

Avalanche technology offers high-power handling capacity and fast response to transient events, ensuring robust protection for sensitive electronics.

Terminal Form: NO LEAD

No-lead terminal form simplifies installation and enhances reliability by eliminating the risk of lead breakage or solder joint failure.

Maximum Repetitive Peak Reverse Voltage: 4 V

High repetitive peak reverse voltage rating ensures continuous protection against transient events, making the product suitable for long-term use in various applications.

Polarity: BIDIRECTIONAL

Bidirectional polarity allows the device to protect against overvoltages in both directions, offering comprehensive protection for connected circuits.

Maximum Clamping Voltage: 7.4 V

The maximum clamping voltage limits the voltage across connected devices during transient events, preventing damage and ensuring system integrity.

Diode Element Material: SILICON

The use of silicon diode element material provides efficient voltage clamping and high surge current capability, ensuring reliable transient suppression performance.

Technical Specifications

Transient Suppression Devices ESDL2031MX4T5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

ULTRA LOW CAPACITANCE

Maximum Breakdown Voltage:

8.5 V

Minimum Breakdown Voltage:

5.1 V

Nominal Breakdown Voltage:

6.8 V

Maximum Clamping Voltage:

7.4 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

72 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

4 V

Maximum Reverse Current:

.05 uA

Reverse Test Voltage:

4 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESDL2031MX4T5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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