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CPH5513-TL-E

Onsemi

CPH5513-TL-E by Onsemi

CPH5513-TL-E by Onsemi is a surface mount diode with max reverse current of 0.1uA and reverse test voltage of 50V. Operating b/w -55 to 125 °C, it has a power dissipation of 0.35W. Ideal for applications requiring low reverse current and high reliability in various electronic circuits.

Median Price

$0.364

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

$0.343

1k+ parts

$0.285

10k+ parts

$0.254

8,500

-

$0.343

$0.285

$0.254

DigiKey

USA . 8,500 parts In-Stock

1+ parts

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$0.430

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8,500

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$0.430

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Farnell

UK . 8,500 parts In-Stock

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$0.231

8,500

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$0.231

Verical

USA . 5,500 parts In-Stock

1+ parts

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$0.386

10k+ parts

$0.318

5,500

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-

$0.386

$0.318

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,958 parts In-Stock

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$0.231

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$0.231

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Digiode

USA . 1,878 parts In-Stock

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$0.268

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1,878

$0.268

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DigiKey Marketplace

USA . 8,500 parts In-Stock

1+ parts

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100+ parts

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$0.290

10k+ parts

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8,500

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-

$0.290

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 354 parts In-Stock

1+ parts

$0.231

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354

$0.231

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Corphita

USA . 2,195 parts In-Stock

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$0.254

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2,195

$0.254

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Native Components

USA . 596 parts In-Stock

1+ parts

$0.943

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596

$0.943

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Northwest PG Solutions

USA . 1,487 parts In-Stock

1+ parts

$1.037

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1,487

$1.037

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Continental Prestige Electronics

USA . 8,500 parts In-Stock

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$0.231

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$0.231

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SupplyDigital Components

Austria . 4,238 parts In-Stock

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TANS Electronics

Latvia . 2,982 parts In-Stock

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Kulean Microsystems

USA . 2,039 parts In-Stock

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Problanco Electronics

Mexico . 1,081 parts In-Stock

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UHIMA Technologies

Türkiye . 342 parts In-Stock

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342

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Overview

Experience superior performance and reliability with the CPH5513-TL-E by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and cutting-edge technology in their products. This surface mount diode offers exceptional precision and efficiency, making it ideal for a wide range of applications. From industrial to automotive projects, this diode provides maximum reverse current of 0.1 uA and a reverse test voltage of 50V, ensuring optimal functionality even in extreme conditions. Trust Onsemi's reputation for excellence and choose the CPH5513-TL-E for your next project.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on circuit boards without the need for additional hardware, saving space and simplifying the manufacturing process.

Maximum Reverse Current: 0.1 uA

Low reverse current ensures minimal power loss and improved efficiency in the circuit where this diode is used.

Reverse Test Voltage: 50 V

Capability to handle up to 50 volts in reverse bias ensures reliability and protection against reverse voltage spikes.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for use in a wide range of environments and applications without the risk of overheating.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures that the diode functions reliably even in extreme cold conditions.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability and ensures a secure connection in the circuit.

Maximum Power Dissipation: 0.35 W

High power dissipation rating allows the diode to handle higher currents without overheating, ensuring long-term reliability.

Maximum Repetitive Peak Reverse Voltage: 50 V

Capable of handling up to 50 volts in reverse bias repeatedly, making it suitable for applications where reverse voltage spikes are common.

Technical Specifications

Other Function Diodes CPH5513-TL-E attributes and parameters. Explore more Other Function Diodes devices from Onsemi

Specs

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Power Dissipation:

.35 W

Maximum Repetitive Peak Reverse Voltage:

50 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

50 V

Sub-Category:

Other Diodes

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

CPH5513-TL-E Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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