Loading...

CPH5512

Onsemi

CPH5512 by Onsemi

CPH5512 by Onsemi is a surface mount diode with max reverse current of 0.1uA and reverse test voltage of 50V. It operates b/w -55 to 125 °C, dissipating up to 0.35W power. Ideal for applications requiring low reverse current and high reverse voltage protection in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,283

-

-

-

-

Digiode

USA . 926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

926

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,989

-

-

-

-

Problanco Electronics

Mexico . 6,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,105

-

-

-

-

TANS Electronics

Latvia . 5,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,298

-

-

-

-

Kulean Microsystems

USA . 2,677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,677

-

-

-

-

Northwest PG Solutions

USA . 1,144 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,144

-

-

-

-

Corphita

USA . 985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

985

-

-

-

-

UHIMA Technologies

Türkiye . 940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

940

-

-

-

-

Corohmni

South Africa . 495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

495

-

-

-

-

Native Components

USA . 388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

388

-

-

-

-

Overview

Experience superior quality and performance with the CPH5512 by Onsemi. As a reputable manufacturer in the industry, Onsemi delivers top-notch products like the CPH5512, a surface-mount diode designed for various applications. Customers can trust in the reliability and efficiency of this product, offering a maximum reverse current of 0.1 uA and a maximum power dissipation of 0.35 W. From automotive to consumer electronics, the CPH5512 provides value, benefits, and advantages that meet your needs and exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to install without the need for additional mounting hardware, saving time and reducing overall product size.

Maximum Reverse Current: 0.1 uA

Low reverse current ensures minimal power loss and better efficiency in the circuit.

Reverse Test Voltage: 50 V

Suitable for applications requiring a reverse voltage protection of up to 50 volts.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without any performance degradation, making it suitable for industrial applications.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperatures, ensuring reliability in harsh environmental conditions.

Maximum Power Dissipation: 0.35 W

Can dissipate up to 0.35 watts of power without overheating, making it robust and durable.

Maximum Repetitive Peak Reverse Voltage: 50 V

Designed to withstand repetitive high reverse voltages of up to 50 volts, ensuring long-term reliability of the diode.

Technical Specifications

Other Function Diodes CPH5512 attributes and parameters. Explore more Other Function Diodes devices from Onsemi

Specs

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Power Dissipation:

.35 W

Maximum Repetitive Peak Reverse Voltage:

50 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

50 V

Sub-Category:

Other Diodes

Surface Mount:

YES

Trade Compliance

CPH5512 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1