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CM2031-A0TR

Onsemi

CM2031-A0TR by Onsemi

CM2031-A0TR by Onsemi is a consumer circuit IC with 38 terminals, operating at -40 to 85 °C. It has power supplies of 3.3V and 5V, suitable for industrial applications. This surface-mount IC in a small outline package measures 9.7mm x 4.4mm, making it ideal for compact electronic devices.

Median Price

$6.582

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 20 parts In-Stock

1+ parts

$6.582

100+ parts

$6.911

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$6.516

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20

$6.582

$6.911

$6.516

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EZ Electronic Parts

Israel . 1,649 parts In-Stock

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Vyrian

USA . 685 parts In-Stock

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685

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Digiode

USA . 568 parts In-Stock

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568

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J2 Sourcing AB

Sweden . 60 parts In-Stock

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Prism Electronics

USA . 47 parts In-Stock

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Native Components

USA . 62 parts In-Stock

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$0.429

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$0.412

62

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$0.412

Northwest PG Solutions

USA . 279 parts In-Stock

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$0.472

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$0.416

279

$0.472

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$0.416

Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$3.805

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100

$3.805

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Corohmni

South Africa . 318 parts In-Stock

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$6.582

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318

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Ampacity Inc.

Singapore . 1,127 parts In-Stock

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$15.800

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SupplyDigital Components

Austria . 5,875 parts In-Stock

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Kulean Microsystems

USA . 5,394 parts In-Stock

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Corphita

USA . 2,030 parts In-Stock

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TANS Electronics

Latvia . 1,961 parts In-Stock

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Kepictronics

USA . 739 parts In-Stock

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UHIMA Technologies

Türkiye . 719 parts In-Stock

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Microchip USA

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Problanco Electronics

Mexico . 95 parts In-Stock

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Perfect Parts

USA . 86 parts In-Stock

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Overview

Elevate your consumer electronics with the CM2031-A0TR by Onsemi. Crafted with precision and expertise, this small outline rectangular IC offers unparalleled quality and reliability. Suitable for a wide range of applications, this consumer circuit is designed to enhance functionality and efficiency. Experience seamless integration with its surface mount design and dual terminal position. With a maximum supply voltage of 5.5V and a low supply current of 0.35 mA, this industrial-grade IC delivers optimal performance without compromise. Trust Onsemi for cutting-edge solutions that elevate your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the IC, making it suitable for various consumer applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the IC onto a PCB, saving time and effort in manufacturing processes.

Power Supplies (V): 3.3,5

With multiple power supply options of 3.3V and 5V, the IC can be used in a wider range of devices and systems, increasing its versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in harsh environmental conditions, making the IC suitable for industrial applications.

Terminal Finish: TIN

The terminal finish of TIN provides good conductivity and solderability, ensuring strong and stable connections for the IC.

Width: 4.4 mm

The compact width of 4.4mm allows for efficient use of space on the PCB, ideal for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the IC can withstand a wide temperature range, making it suitable for industrial settings with varying operating conditions.

Maximum Supply Current: 0.35 mA

The low maximum supply current of 0.35mA helps in reducing power consumption, making the IC energy-efficient and cost-effective in operation.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for flexibility in power input options, making the IC compatible with a wide range of voltage sources.

Technical Specifications

Other Function Consumer ICs CM2031-A0TR attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

.35 mA

Maximum Supply Voltage (Vsup):

5.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CM2031-A0TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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