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CM2009-02QR

Onsemi

CM2009-02QR by Onsemi

CM2009-02QR by Onsemi is a 16-terminal CONSUMER CIRCUIT IC with 5V power supply, operating b/w -40 to 85 °C. It comes in a small outline package with GULL WING terminals and is suitable for industrial applications requiring a compact design and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 23,205 parts In-Stock

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Digiode

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Vyrian

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LWI Electronics Inc

India . 10 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 7,410 parts In-Stock

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Kulean Microsystems

USA . 7,147 parts In-Stock

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SupplyDigital Components

Austria . 6,049 parts In-Stock

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TANS Electronics

Latvia . 5,959 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,940 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 2,598 parts In-Stock

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Corphita

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Formix International (Excess)

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UHIMA Technologies

Türkiye . 900 parts In-Stock

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GreenTree Electronics

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Overview

Looking to enhance consumer electronics performance? Look no further than the CM2009-02QR by Onsemi. With a reputation for superior quality and reliability, Onsemi delivers cutting-edge technology in a compact and efficient package. Ideal for a wide range of applications, this consumer circuit IC offers customers unparalleled value and benefits. Upgrade your devices with Onsemi's CM2009-02QR for unmatched performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for consumer electronics.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape enhances space efficiency and makes it easier to fit into electronic devices.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer circuits, ensuring optimal performance in consumer electronic products.

Power Supplies (V): 5

Operates at a standard power supply voltage of 5V, compatible with many consumer electronic applications.

No. of Terminals: 16

Sufficient number of terminals for connectivity in consumer circuits.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style with small outline and shrink pitch saves space on circuit boards.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality in a wide range of temperature settings.

Terminal Finish: TIN

Tin terminal finish provides good electrical conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connections and reduces the chance of signal interference.

Maximum Seated Height: 1.75 mm

Low seated height makes the product suitable for compact electronic devices.

Width: 3.895 mm

Narrow width contributes to the overall space-saving design of the product.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time helps in efficient manufacturing processes and reduces the chances of component overheating.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering of the component during manufacturing.

Length: 4.9 mm

Compact length of the product contributes to its space-saving design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering during assembly.

Terminal Pitch: 0.64 mm

Fine terminal pitch allows for high-density mounting on circuit boards, ideal for miniaturized electronic devices.

Technical Specifications

Other Function Consumer ICs CM2009-02QR attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.64 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

CM2009-02QR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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