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CM2020-01TR

Onsemi

CM2020-01TR by Onsemi

CM2020-01TR by Onsemi is a small outline consumer IC with 38 terminals and operates at industrial temperature grade. It features a supply voltage of 5.5V, max current of 0.13mA, and uses CMOS technology. This rectangular package is designed for consumer circuit applications requiring a compact form factor and low power consumption.

Median Price

$1.810

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$2.839

100+ parts

$2.583

1k+ parts

$2.328

10k+ parts

-

3,000

$2.839

$2.583

$2.328

-

DigiKey

USA . 110,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.780

10k+ parts

-

110,000

-

-

$0.780

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Flip Electronics (Authorized)

USA . 110,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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110,000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,078 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

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10k+ parts

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1,078

$0.780

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-

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Digiode

USA . 2,060 parts In-Stock

1+ parts

$2.697

100+ parts

-

1k+ parts

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10k+ parts

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2,060

$2.697

-

-

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Ozdisan Elektronik

Türkiye . 10 parts In-Stock

1+ parts

$7.011

100+ parts

-

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10

$7.011

-

-

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DigiKey Marketplace

USA . 110,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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110,000

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Flip Electronics

USA . 105,000 parts In-Stock

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105,000

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Chip Stock

USA . 11,075 parts In-Stock

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11,075

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Bristol Electronics

USA . 2,919 parts In-Stock

1+ parts

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2,919

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EPE Components Inc.

USA . 2,480 parts In-Stock

1+ parts

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2,480

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Classic Components Corporation

USA . 2,435 parts In-Stock

1+ parts

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2,435

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LIBRA Elektronik GmbH

Germany . 346 parts In-Stock

1+ parts

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346

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NexGen Digital

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 724 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

-

10k+ parts

$0.224

724

$0.234

-

-

$0.224

Northwest PG Solutions

USA . 1,470 parts In-Stock

1+ parts

$0.257

100+ parts

-

1k+ parts

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$0.226

1,470

$0.257

-

-

$0.226

Corohmni

South Africa . 498 parts In-Stock

1+ parts

$0.780

100+ parts

-

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498

$0.780

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Corphita

USA . 197 parts In-Stock

1+ parts

$2.555

100+ parts

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197

$2.555

-

-

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.839

100+ parts

$2.583

1k+ parts

$2.328

10k+ parts

-

3,000

$2.839

$2.583

$2.328

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Perfect Parts

USA . 28,688 parts In-Stock

1+ parts

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28,688

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TANS Electronics

Latvia . 7,412 parts In-Stock

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7,412

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Problanco Electronics

Mexico . 7,009 parts In-Stock

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7,009

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A-Z Elektronik GmbH

Germany . 6,629 parts In-Stock

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6,629

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Kulean Microsystems

USA . 6,083 parts In-Stock

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6,083

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Microchip USA

USA . 4,898 parts In-Stock

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4,898

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Alle Elektronik GmbH

Germany . 4,419 parts In-Stock

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4,419

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QUARKTWIN TECHNOLOGY LTD

USA . 4,223 parts In-Stock

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4,223

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Metaverse IC Inc.

Canada . 2,694 parts In-Stock

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2,694

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SupplyDigital Components

Austria . 2,338 parts In-Stock

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2,338

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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UHIMA Technologies

Türkiye . 780 parts In-Stock

1+ parts

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780

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iodParts Technologies Inc.

India . 65 parts In-Stock

1+ parts

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100+ parts

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65

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Overview

Discover the cutting-edge CM2020-01TR by Onsemi, a top-tier manufacturer known for its superior quality and reliability. This consumer IC offers endless possibilities in various applications, thanks to its innovative design and advanced technology. With a small outline package and industrial-grade temperature tolerance, this product is a game-changer in the industry. Experience the exceptional value and benefits it provides, from increased efficiency to enhanced performance. Elevate your projects with the CM2020-01TR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a good balance between durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly on circuit boards, saving time and effort during manufacturing.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, making it suitable for a wide range of electronic devices used by end users.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a variety of existing systems and devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures up to 85 °C, ensuring reliable performance in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the IC.

Technical Specifications

Other Function Consumer ICs CM2020-01TR attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

.13 mA

Maximum Supply Voltage (Vsup):

5.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CM2020-01TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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