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CM1636-08DE

Onsemi

CM1636-08DE by Onsemi

CM1636-08DE by Onsemi is a data line filter with 8 functions. It has a max operating temperature of 85 °C and min of -40°C. With dimensions of L3.4XB1.45XH0.55 (mm), it is ideal for applications requiring a DC resistance of 240 ohm, output impedance of 50 OHM, and capacitance of 30 uF.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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TANS Electronics

Latvia . 6,030 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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Corphita

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Northwest PG Solutions

USA . 870 parts In-Stock

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Native Components

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UHIMA Technologies

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Overview

Enhance the performance and reliability of your electronic devices with the CM1636-08DE data line filter by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that are IEC approved and designed for maximum efficiency. With 8 functions and a compact design, this filter is ideal for a wide range of applications. Experience reduced interference, improved signal quality, and enhanced overall functionality with the CM1636-08DE. Upgrade your devices today and enjoy the benefits of superior filtering technology.

Feature Benefit Bullets

Approvals (V) IEC: No

Ensures that the product meets international safety standards, making it a reliable choice for use in various applications.

No. of Functions: 8

Provides multiple filter functions in a single device, offering comprehensive protection for data lines.

Filter Type: DATA LINE FILTER

Specifically designed to filter out interference on data lines, ensuring data integrity and reliability.

Maximum Operating Temperature: 85 °C

Allows the product to be used in high-temperature environments without performance degradation, increasing its versatility.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperatures, making it suitable for a wide range of environments.

Terminal Finish: Tin (Sn)

Tin terminal finish provides excellent solderability and conductivity, ensuring a reliable electrical connection.

Width (mm): 1.45

Compact width allows for space-efficient installation, making it suitable for applications with limited space.

Maximum DC Resistance: 240 ohm

Low DC resistance ensures efficient power transfer and minimal power loss, improving overall performance.

Length: 3.4 mm

Compact length allows for easy integration into existing systems without taking up too much space.

Output Impedance (ohm): 50 OHM

Optimal output impedance ensures proper signal transmission and reception, reducing interference and signal loss.

Packing Method: TAPE AND REEL

Tape and reel packaging provides convenience during assembly and allows for automated pick-and-place processes.

Mounting Type: SURFACE MOUNT

Surface mount design simplifies installation and enhances reliability, suitable for modern electronic devices.

Dimensions: L3.4XB1.45XH0.55 (mm)/L0.134XB0.057XH0.022 (inch)

Compact dimensions make it easy to integrate the product into various electronic devices or systems.

Height: 0.55 mm

Low height profile allows for easy integration without adding bulk, ideal for applications with space constraints.

Capacitance: 30 uF

Optimal capacitance value ensures effective filtering of noise and interference on data lines, improving signal quality.

Technical Specifications

Data Line Filters CM1636-08DE attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Additional Features:

PI-TYPE CIRCUIT

Approvals (V):

IEC

Capacitance:

30 uF

Maximum DC Resistance:

Filter Type:

Height:

.55 mm

JESD-609 Code:

e3

Length:

3.4 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Impedance (ohm):

50 OHM

Packing Method:

TAPE AND REEL

Dimensions:

L3.4XB1.45XH0.55 (mm)/L0.134XB0.057XH0.022 (inch)

Terminal Finish:

Tin (Sn)

Width (mm):

1.45

Trade Compliance

CM1636-08DE Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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