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CM1636-04DE

Onsemi

CM1636-04DE by Onsemi

CM1636-04DE by Onsemi is a Data Line Filter with 4 functions, 240 ohm DC resistance, and 30uF capacitance. It operates b/w -40 to 85 °C and has an output impedance of 50 ohm. Ideal for applications requiring IEC approvals in surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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Digiode

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TANS Electronics

Latvia . 8,220 parts In-Stock

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Kulean Microsystems

USA . 8,091 parts In-Stock

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SupplyDigital Components

Austria . 4,928 parts In-Stock

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Problanco Electronics

Mexico . 4,446 parts In-Stock

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Northwest PG Solutions

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Corphita

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Native Components

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UHIMA Technologies

Türkiye . 301 parts In-Stock

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Overview

Enhance the performance and reliability of your electronic devices with the CM1636-04DE by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and innovative design in their Data Line Filters. Approved by IEC standards, this product offers 4 functions in one compact package. From safeguarding against interference to improving signal clarity, this filter provides enhanced functionality for a wide range of applications. Trust Onsemi to deliver exceptional value and superior benefits to meet all your filtering needs.

Feature Benefit Bullets

Approvals (V) IEC

Having IEC approvals ensures that the product meets recognized international safety standards.

No. of Functions

Having 4 functions allows for effective filtering of data lines, providing reliable protection to connected devices.

Filter Type

Being a data line filter indicates that this product is specifically designed to reduce electrical noise and interference on data lines.

Maximum Operating Temperature

With a maximum operating temperature of 85 °C, this product can withstand high temperatures, making it suitable for various environments.

Minimum Operating Temperature

The ability to operate at temperatures as low as -40 °C ensures reliable performance even in extremely cold conditions.

Terminal Finish

Tin (Sn) terminal finish provides good solderability and conductivity, ensuring a secure and reliable connection.

Width (mm)

With a slim width of 1.45mm, this product is suitable for applications where space is limited.

Maximum DC Resistance

A maximum DC resistance of 240 ohms ensures efficient filtering and minimal signal loss.

Length

With a length of 1.8mm, this product is compact and suitable for small electronic devices or tight spaces.

Output Impedance (ohm)

An output impedance of 50 ohms ensures compatibility with a wide range of devices and minimizes signal reflection.

Packing Method

Packaged in tape and reel format for easy handling and automated assembly, saving time and reducing the risk of damage during transportation.

Mounting Type

Surface mount design allows for easy installation on circuit boards, making it suitable for mass production and compact electronic devices.

Dimensions

Compact dimensions of L1.8xB1.45xH0.55 mm (L0.071xB0.057xH0.022 inch) make this product versatile and suitable for various applications.

Height

With a height of only 0.55mm, this product is low-profile and ideal for space-constrained designs.

Capacitance

A capacitance of 30uF helps in filtering out unwanted frequencies and ensuring smooth data transmission.

Technical Specifications

Data Line Filters CM1636-04DE attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Additional Features:

PI-TYPE CIRCUIT

Approvals (V):

IEC

Capacitance:

30 uF

Maximum DC Resistance:

Filter Type:

Height:

.55 mm

JESD-609 Code:

e3

Length:

1.8 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Impedance (ohm):

50 OHM

Packing Method:

TAPE AND REEL

Dimensions:

L1.8XB1.45XH0.55 (mm)/L0.071XB0.057XH0.022 (inch)

Terminal Finish:

Tin (Sn)

Width (mm):

1.45

Trade Compliance

CM1636-04DE Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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