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CM1681-02DE

Onsemi

CM1681-02DE by Onsemi

CM1681-02DE by Onsemi is a Data Line Filter with 2 functions, operating b/w -40 to 85 °C. It has a max DC resistance of 12 ohm and output impedance of 50 ohm. Ideal for applications requiring surface mount filters with dimensions of L2.1xB2.1xH0.55 mm and capacitance of 100 uF.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Native Components

USA . 416 parts In-Stock

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Northwest PG Solutions

USA . 1,917 parts In-Stock

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Problanco Electronics

Mexico . 7,994 parts In-Stock

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SupplyDigital Components

Austria . 5,994 parts In-Stock

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TANS Electronics

Latvia . 3,322 parts In-Stock

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Kulean Microsystems

USA . 1,155 parts In-Stock

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Corphita

USA . 533 parts In-Stock

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UHIMA Technologies

Türkiye . 184 parts In-Stock

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Corohmni

South Africa . 157 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the CM1681-02DE by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their products. This data line filter offers two functions, ensuring optimal efficiency in filtering out unwanted signals. Perfect for applications requiring precise data transmission, this filter operates at a wide temperature range from -40 to 85 °C. With its compact size and surface mount design, the CM1681-02DE provides convenience and ease of installation. Trust Onsemi to deliver exceptional value and performance with this cutting-edge data line filter.

Feature Benefit Bullets

No. of Functions: 2

Having 2 functions allows for better filtering and protection of data lines, ensuring reliable performance.

Filter Type: DATA LINE FILTER

Designed specifically for data lines, providing effective filtering to reduce interference and maintain signal integrity.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without affecting performance, ensuring reliability in various operating conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in low temperature environments, making it versatile and reliable in different applications.

Width (mm): 2.1

Compact size allows for easy integration into circuit designs without taking up much space.

Maximum DC Resistance: 12 ohm

Low resistance helps in maintaining signal integrity and minimizes power loss across the data line filter.

Length: 2.1 mm

Compact dimensions make it suitable for space-constrained applications where size is a critical factor.

Output Impedance (ohm): 50 OHM

Optimal output impedance ensures compatibility with a wide range of devices and systems, making it versatile.

Packing Method: TAPE AND REEL

Convenient packing method facilitates easy handling, storage, and installation, saving time and effort.

Mounting Type: SURFACE MOUNT

Surface mount design simplifies the assembly process and allows for efficient placement on circuit boards.

Dimensions: L2.1XB2.1XH0.55 (mm)/L0.083XB0.083XH0.022 (inch)

Compact and standardized dimensions ensure easy integration and compatibility with industry-standard requirements.

Height: 0.55 mm

Low profile height enables installation in compact spaces without compromising on performance or functionality.

Capacitance: 100 uF

High capacitance value helps in filtering out unwanted noise and interference, ensuring clean and reliable data transmission.

Technical Specifications

Data Line Filters CM1681-02DE attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Additional Features:

CUT-OFF FREQUENCY 31 MHZ; PI-TYPE CIRCUIT

Capacitance:

100 uF

Maximum DC Resistance:

Filter Type:

Height:

.55 mm

Length:

2.1 mm

Manufacturer Series:

CM1681

Mounting Type:

SURFACE MOUNT

No. of Functions:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Impedance (ohm):

50 OHM

Packing Method:

TAPE AND REEL

Dimensions:

L2.1XB2.1XH0.55 (mm)/L0.083XB0.083XH0.022 (inch)

Width (mm):

2.1

Trade Compliance

CM1681-02DE Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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