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CAT1024ZD4I-42T3

Onsemi

CAT1024ZD4I-42T3 by Onsemi

CAT1024ZD4I-42T3 by Onsemi is a Power Management IC with 8 terminals, Vsup range of 2.7V to 5.5V, and +4.375V nominal threshold voltage. It operates in industrial temperature grade (-40 to 85 °C) and supports power supply circuits in small outline package for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,689 parts In-Stock

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Digiode

USA . 2,035 parts In-Stock

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Native Components

USA . 880 parts In-Stock

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$0.056

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$0.054

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$0.054

Corohmni

South Africa . 242 parts In-Stock

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$8.476

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AZTECH Wire

Italy . 650 parts In-Stock

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$14.100

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Kulean Microsystems

USA . 2,804 parts In-Stock

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Problanco Electronics

Mexico . 2,266 parts In-Stock

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Corphita

USA . 1,581 parts In-Stock

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TANS Electronics

Latvia . 1,405 parts In-Stock

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SupplyDigital Components

Austria . 924 parts In-Stock

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Northwest PG Solutions

USA . 478 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 266 parts In-Stock

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Overview

Unlock the power of efficient and reliable power management with the CAT1024ZD4I-42T3 by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled performance and durability for a wide range of applications. From industrial settings to consumer electronics, this small outline, very thin profile package ensures seamless integration into any project. Say goodbye to power supply woes and hello to optimized efficiency with Onsemi's cutting-edge technology. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Easy to install without the need for additional hardware, reducing assembly time and cost.

Nominal Supply Voltage (Vsup): 5 V

Common voltage level that is compatible with a wide range of devices and power sources.

No. of Terminals: 8

Provides ample connectivity options for interfacing with other components in a circuit.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold temperatures, allowing for use in a variety of conditions.

Technology: CMOS

Utilizes CMOS technology for efficient power management and low power consumption.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher voltage inputs for added flexibility in power supply options.

Technical Specifications

Power Management ICs CAT1024ZD4I-42T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.375V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.375V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

CAT1024ZD4I-42T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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