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BMS4003

Onsemi

BMS4003 by Onsemi

BMS4003 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. It has a max IDM of 72A and EAS of 53mJ, suitable for SWITCHING applications. The transistor features 0.065 ohm RDS(on), SILICON element, and ENHANCEMENT MODE operation in a RECTANGULAR package.

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1k+

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Digiode

USA . 1,878 parts In-Stock

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Native Components

USA . 230 parts In-Stock

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$25.990

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Northwest PG Solutions

USA . 463 parts In-Stock

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$25.730

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TANS Electronics

Latvia . 8,013 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

USA . 3,628 parts In-Stock

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SupplyDigital Components

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Corohmni

South Africa . 339 parts In-Stock

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Corphita

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UHIMA Technologies

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Overview

Upgrade your power system with the BMS4003 by Onsemi. Known for their high-quality manufacturing, Onsemi delivers top-notch Power Field Effect Transistors (FET) that are perfect for switching applications. The BMS4003 features N-CHANNEL polarity, a built-in diode, and an impressive 100V minimum DS breakdown voltage. With a maximum pulsed drain current of 72A and a low on-resistance of 0.065 ohm, this transistor offers exceptional performance and reliability. Whether you're looking to enhance your power management system or improve efficiency, the BMS4003 provides value, benefits, and advantages that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have faster switching speeds and lower on-state resistance compared to P-channel FETs, making them ideal for many high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient reverse voltage protection, preventing damage to the transistor during switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and efficient power handling capabilities.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, ensuring reliability in high voltage circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation in various electronic applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals are easy to solder and provide a strong mechanical connection, ensuring stable operation in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation, allowing for precise modulation of power flow in the circuit.

Maximum Pulsed Drain Current (IDM): 72 A

This high current rating allows the FET to handle large peak currents, making it suitable for high power applications with intermittent load conditions.

Avalanche Energy Rating (EAS): 53 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient events, ensuring long-term reliability in harsh operating conditions.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit design and installation, making the FET easy to integrate into various electronic systems.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure attachment to heat sinks or mounting surfaces, ensuring efficient heat dissipation and prolonged lifespan.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low gate drive voltage, high input impedance, and fast switching speeds, making it a popular choice for power switching applications.

Transistor Element Material: SILICON

Silicon-based transistors offer good thermal stability, high breakdown voltage, and low leakage current, ensuring reliable performance in a wide range of operating conditions.

Maximum Drain Current (ID): 18 A

With a high drain current rating, this FET can handle large continuous currents without overheating, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.065 ohm

The low on-resistance reduces power losses and improves efficiency in the circuit, making the FET an excellent choice for high-power applications where efficiency is critical.

Terminal Position: SINGLE

The single terminal position simplifies circuit layout and connection, making it easy to integrate the FET into existing electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) BMS4003 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

53 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BMS4003 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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