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BD238G

Onsemi

BD238G by Onsemi

BD238G by Onsemi is a PNP BJT transistor with 80V VCEO, 2A IC, and 25W Ptot. Ideal for amplifier applications, it has hFE of 25, operates b/w -55 to 150 °C, and features a flange mount package style.

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Northwest PG Solutions

USA . 200 parts In-Stock

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$11.660

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AZTECH Wire

Italy . 889 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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UHIMA Technologies

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Overview

Unleash the power of innovation with the Onsemi BD238G, a top-of-the-line Power Bipolar Junction Transistor. Manufactured by industry leader Onsemi, this PNP transistor offers exceptional quality and reliability for all your amplifier needs. Whether you're looking to boost performance or enhance efficiency, the BD238G delivers unparalleled value with its high power dissipation, wide operating temperature range, and impressive collector-emitter voltage. Upgrade your electronic devices today with the Onsemi BD238G and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for the package, making it suitable for various applications.

Polarity or Channel Type: PNP

PNP configuration allows for easy integration into PNP circuit designs, adding versatility to the product.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and installation, making it user-friendly for both hobbyists and professionals.

Transistor Application: AMPLIFIER

Designed for amplifier applications, providing high-quality signal amplification for audio or other electronic signals.

Package Shape: RECTANGULAR

RECTANGULAR shape allows for easy mounting and placement within a circuit or on a PCB board.

Terminal Form: THROUGH-HOLE

THROUGH-HOLE terminals make soldering and connections straightforward, ensuring a secure and stable connection.

No. of Terminals: 3

3 terminals provide the necessary connections for the transistor to function correctly in a circuit.

Maximum Power Dissipation (Abs): 25 W

With a maximum power dissipation of 25W, this transistor can handle high-power applications with ease.

Package Style (Meter): FLANGE MOUNT

FLANGE MOUNT package style ensures easy installation and secure mounting, ideal for industrial or commercial use.

Minimum DC Current Gain (hFE): 25

Minimum DC current gain of 25 ensures stable and reliable amplification of signals in various applications.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150 °C, making it suitable for high-temperature environments.

Maximum Collector-Emitter Voltage: 80 V

With a maximum collector-emitter voltage of 80V, this transistor can handle a wide range of voltage applications.

Transistor Element Material: SILICON

SILICON material provides excellent performance and reliability for the transistor element, ensuring long-term operation.

Minimum Operating Temperature: -55 °C

Operates at temperatures as low as -55 °C, making it suitable for cold environments or applications.

Maximum Collector Current (IC): 2 A

Can handle collector currents up to 2A, allowing for high-current applications without overheating.

Terminal Finish: TIN

TIN terminal finish ensures good electrical conductivity and corrosion resistance for reliable connections.

Terminal Position: SINGLE

SINGLE terminal position simplifies connections and ensures a clear layout for easy circuit design.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this transistor can withstand high-temperature soldering processes.

Nominal Transition Frequency (fT): 3 MHz

Nominal transition frequency of 3MHz allows for high-speed switching and signal processing in various applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BD238G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

2 A

Maximum Collector-Emitter Voltage:

80 V

Configuration:

Minimum DC Current Gain (hFE):

25

JEDEC-95 Code:

TO-225AA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BD238G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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