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ATP301-TL-H

Onsemi

ATP301-TL-H by Onsemi

The Onsemi ATP301-TL-H is a P-CHANNEL FET with 100V DS breakdown voltage, 112A IDM, and 0.075 ohm RDS(on). Ideal for power applications requiring high drain current handling. Suitable for surface mount designs due to its small outline package style.

Median Price

$1.162

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$1.133

100+ parts

$0.911

1k+ parts

$0.850

10k+ parts

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1

$1.133

$0.911

$0.850

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Chip1Stop

Japan . 1 parts In-Stock

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$1.190

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$1.190

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Digiode

USA . 1,334 parts In-Stock

1+ parts

$0.677

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1,334

$0.677

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Chip Stock

USA . 101,399 parts In-Stock

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Vyrian

USA . 5,238 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 788 parts In-Stock

1+ parts

$0.642

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788

$0.642

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Corohmni

South Africa . 375 parts In-Stock

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$0.713

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375

$0.713

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Northwest PG Solutions

USA . 2,333 parts In-Stock

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$2.572

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2,333

$2.572

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AZTECH Wire

Italy . 1,072 parts In-Stock

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$18.750

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Kepictronics

USA . 81,000 parts In-Stock

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Assy Fe

Spain . 11,820 parts In-Stock

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Perfect Parts

USA . 10,463 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kulean Microsystems

USA . 2,979 parts In-Stock

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2,979

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Problanco Electronics

Mexico . 1,680 parts In-Stock

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1,680

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TANS Electronics

Latvia . 1,530 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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SupplyDigital Components

Austria . 862 parts In-Stock

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862

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Native Components

USA . 571 parts In-Stock

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$2.268

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571

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$2.268

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UHIMA Technologies

Türkiye . 407 parts In-Stock

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407

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Microchip USA

USA . 381 parts In-Stock

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Overview

Unlock the full potential of your power applications with the ATP301-TL-H by Onsemi. Crafted with precision and expertise, this P-CHANNEL Power FET offers unparalleled quality and reliability. Perfect for a wide range of uses, from industrial to automotive, this versatile component boasts a single configuration with a built-in diode for enhanced performance. With a maximum operating temperature of 150 °C and a minimum DS breakdown voltage of 100V, this FET delivers exceptional value and efficiency. Trust Onsemi to provide you with cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and reliability to the product, making it suitable for various applications.

Polarity or Channel Type: P-CHANNEL

P-Channel type configuration allows for efficient power management and control, making it a good choice for power control circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of the product by providing reverse voltage protection, making it ideal for power management systems.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 100 V

The high minimum breakdown voltage ensures reliable performance and protection against voltage spikes, making it suitable for high voltage applications.

Maximum Pulsed Drain Current (IDM): 112 A

The high pulsed drain current rating allows for handling high current loads, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 70 W

The high power dissipation capacity ensures efficient heat dissipation and overall reliability of the product during operation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature range allows for operation in a wide range of environments, making it versatile and reliable.

Technical Specifications

Power Field Effect Transistors (FET) ATP301-TL-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

54 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

112 A

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

ATP301-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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